61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100
特徴
- Very soft heat-conducting gel.
- It achieves high thermal conductivity and exerts excellent effects on heat dissipation.
- It adheres to uneven surfaces with excellent flexibility and stickiness, and does not create an air layer on the contact surface.
- Excellent electrical insulation and flame retardancy.
- Can be used in a wide range of temperatures.
- Because the molecules are gently cross-linked, it is difficult to cause "dripping" or "vaporization."
- Heat dissipation inside a personal computer (CPU, board, etc.).
- Heat dissipation of power transistors and power supply components.
- Heat dissipation of semiconductor elements that generate heat such as electronic equipment.
- A gap around a heating element such as a high-density semiconductor device.
- Top, side, and lead wires of heating elements such as ICs.
- Heating point where sticking the sheet is difficult.
- Where there is no space for mounting the heat conductive material.
Spec
- Specific gravity: 2.8
- Operating temperature range (℃): -40 - 200
- Capacity (cc): 30
- Mass (G): 95
- Volume Resistivity (Ω ・ cm): 5. 9x10 ^ 13
- Insulation fracture strength (KV/cm mm): 5
- hardness (consistency) (1 10mm, mix): 51
- Conductivity: 6. 5W/m, K (measuring method), 2. 1W/m, K (hot wire method)
- silicon gel, Thermal conductivity filler
- Application: PC internal (CPU, board, etc). power transistor, Power parts. Electron equipment such as heat generation semiconductor element. high Density semiconductor elements of heater around the gap. IC such as heating elements of the top surface, the side surface and lead wire. Sheet pasting is difficult hot spots. thermal installation space the margins is not.
- Country of origin: Japan
- Weight: 95g
- * Please use [HA pre-tested"and corresponding Application to proper to check.
- * general industrial Application for developed. medical implant product for absolute use Do not.
- * various data is guaranteed value The. Also contents is performance improvement, Specification Changes for notice no change if.
- * usage by silicon raw material from Oil minutes but ooze it.
- * low minutes child siloxane" containing.
- Manufacturer's model number: DP100
- CODE No.: 434-8559
Package sizePackage sizes="init">
61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100
特徴
- Very soft heat-conducting gel.
- It achieves high thermal conductivity and exerts excellent effects on heat dissipation.
- It adheres to uneven surfaces with excellent flexibility and stickiness, and does not create an air layer on the contact surface.
- Excellent electrical insulation and flame retardancy.
- Can be used in a wide range of temperatures.
- Because the molecules are gently cross-linked, it is difficult to cause "dripping" or "vaporization."
- Heat dissipation inside a personal computer (CPU, board, etc.).
- Heat dissipation of power transistors and power supply components.
- Heat dissipation of semiconductor elements that generate heat such as electronic equipment.
- A gap around a heating element such as a high-density semiconductor device.
- Top, side, and lead wires of heating elements such as ICs.
- Heating point where sticking the sheet is difficult.
- Where there is no space for mounting the heat conductive material.
仕様
- Specific gravity: 2.8
- Operating temperature range (℃): -40 - 200
- Capacity (cc): 30
- Mass (G): 95
- Volume Resistivity (Ω ・ cm): 5. 9x10 ^ 13
- Insulation fracture strength (KV/cm mm): 5
- hardness (consistency) (1 10mm, mix): 51
- Conductivity: 6. 5W/m, K (measuring method), 2. 1W/m, K (hot wire method)
- silicon gel, Thermal conductivity filler
- Application: PC internal (CPU, board, etc). power transistor, Power parts. Electron equipment such as heat generation semiconductor element. high Density semiconductor elements of heater around the gap. IC such as heating elements of the top surface, the side surface and lead wire. Sheet pasting is difficult hot spots. thermal installation space the margins is not.
- Country of origin: Japan
- Weight: 95g
- * Please use [HA pre-tested"and corresponding Application to proper to check.
- * general industrial Application for developed. medical implant product for absolute use Do not.
- * various data is guaranteed value The. Also contents is performance improvement, Specification Changes for notice no change if.
- * usage by silicon raw material from Oil minutes but ooze it.
- * low minutes child siloxane" containing.
- Manufacturer's model number: DP100
- CODE No.: 434-8559
荷姿サイズ：45×30×130 mm 110 g [About Package size]
| アズワン品番 | 61-2212-41 | |
|---|---|---|
| 型番 | DP-100 | |
| JANコード | 4571191312532 | |
| 標準価格 |
JPY: 11,588
USD: 72.64
Excange rate 1USD= 159.53JPY
Valid price in Japan |
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| 入り数 | 1piece | |
| 在庫数 |
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| サプライヤ在庫 |
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商品のバリエーション （サイズ違い・スペック違い・オプション品など）
| 商品イメージ | アズワン品番 | 商品名 | 型番 |
Product categories |
入り数 | 標準価格 | 標準価格(ドル) | アズワン在庫 [サプライヤ在庫] |
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|---|---|---|---|---|---|---|---|---|---|
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61-2212-41 | Paste form thermal gel DP Series DP-100 6.5W/mK DP-100 | DP-100 | Silicon (paste type) | 1piece | JPY: 11,588 | USD: 72.64 |
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61-2212-33 | Gel Sheet lambda gel hardness 45 COH-4000LVC0.5mm COH-4000LVC-T0.5 | COH-4000LVC-T0.5 | Silicon (sheet type) | 1sheet | JPY: 9,938 | USD: 62.30 |
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61-2212-34 | Gel Sheet lambda gel hardness 45 COH-4000LVC1.0mm COH-4000LVC-T1 | COH-4000LVC-T1 | Silicon (sheet type) | 1sheet | JPY: 16,813 | USD: 105.39 |
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61-2212-35 | Gel Sheet lambda gel hardness 45 COH-4000LVC2.0mm COH-4000LVC-T2 | COH-4000LVC-T2 | Silicon (sheet type) | 1sheet | JPY: 32,000 | USD: 200.59 |
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61-2212-36 | Gel Sheet lambda gel hardness 45 COH-4000LVC3.0mm COH-4000LVC-T3 | COH-4000LVC-T3 | Silicon (sheet type) | 1sheet | JPY: 45,700 | USD: 286.47 |
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