61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100
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61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100 【AXEL GLOBAL】<!--@[ss-27]@--> アズワン<!--@/[ss-27]@--> Contact us
Taica Corporation 61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100
Features
- Very soft heat-conducting gel.
- It achieves high thermal conductivity and exerts excellent effects on heat dissipation.
- It adheres to uneven surfaces with excellent flexibility and stickiness, and does not create an air layer on the contact surface.
- Excellent electrical insulation and flame retardancy.
- Can be used in a wide range of temperatures.
- Because the molecules are gently cross-linked, it is difficult to cause "dripping" or "vaporization."
- Heat dissipation inside a personal computer (CPU, board, etc.).
- Heat dissipation of power transistors and power supply components.
- Heat dissipation of semiconductor elements that generate heat such as electronic equipment.
- A gap around a heating element such as a high-density semiconductor device.
- Top, side, and lead wires of heating elements such as ICs.
- Heating point where sticking the sheet is difficult.
- Where there is no space for mounting the heat conductive material.
仕様
- Specific gravity: 2.8
- Operating temperature range (℃): -40 - 200
- Capacity (cc): 30
- Mass (G): 95
- Volume Resistivity (Ω ・ cm): 5. 9x10 ^ 13
- Insulation fracture strength (KV/cm mm): 5
- hardness (consistency) (1 10mm, mix): 51
- Conductivity: 6. 5W/m, K (measuring method), 2. 1W/m, K (hot wire method)
- silicon gel, Thermal conductivity filler
- Application: PC internal (CPU, board, etc). power transistor, Power parts. Electron equipment such as heat generation semiconductor element. high Density semiconductor elements of heater around the gap. IC such as heating elements of the top surface, the side surface and lead wire. Sheet pasting is difficult hot spots. thermal installation space the margins is not.
- Country of origin: Japan
- Weight: 95g
- * Please use [HA pre-tested"and corresponding Application to proper to check.
- * general industrial Application for developed. medical implant product for absolute use Do not.
- * various data is guaranteed value The. Also contents is performance improvement, Specification Changes for notice no change if.
- * usage by silicon raw material from Oil minutes but ooze it.
- * low minutes child siloxane" containing.
- Manufacturer's model number: DP100
- CODE No.: 434-8559
Package sizePackage sizes="init">
61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100 【AXEL GLOBAL】<!--@[ss-27]@--> アズワン<!--@/[ss-27]@--> Contact us
Taica Corporation 61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100
特徴
- Very soft heat-conducting gel.
- It achieves high thermal conductivity and exerts excellent effects on heat dissipation.
- It adheres to uneven surfaces with excellent flexibility and stickiness, and does not create an air layer on the contact surface.
- Excellent electrical insulation and flame retardancy.
- Can be used in a wide range of temperatures.
- Because the molecules are gently cross-linked, it is difficult to cause "dripping" or "vaporization."
- Heat dissipation inside a personal computer (CPU, board, etc.).
- Heat dissipation of power transistors and power supply components.
- Heat dissipation of semiconductor elements that generate heat such as electronic equipment.
- A gap around a heating element such as a high-density semiconductor device.
- Top, side, and lead wires of heating elements such as ICs.
- Heating point where sticking the sheet is difficult.
- Where there is no space for mounting the heat conductive material.
仕様
- Specific gravity: 2.8
- Operating temperature range (℃): -40 - 200
- Capacity (cc): 30
- Mass (G): 95
- Volume Resistivity (Ω ・ cm): 5. 9x10 ^ 13
- Insulation fracture strength (KV/cm mm): 5
- hardness (consistency) (1 10mm, mix): 51
- Conductivity: 6. 5W/m, K (measuring method), 2. 1W/m, K (hot wire method)
- silicon gel, Thermal conductivity filler
- Application: PC internal (CPU, board, etc). power transistor, Power parts. Electron equipment such as heat generation semiconductor element. high Density semiconductor elements of heater around the gap. IC such as heating elements of the top surface, the side surface and lead wire. Sheet pasting is difficult hot spots. thermal installation space the margins is not.
- Country of origin: Japan
- Weight: 95g
- * Please use [HA pre-tested"and corresponding Application to proper to check.
- * general industrial Application for developed. medical implant product for absolute use Do not.
- * various data is guaranteed value The. Also contents is performance improvement, Specification Changes for notice no change if.
- * usage by silicon raw material from Oil minutes but ooze it.
- * low minutes child siloxane" containing.
- Manufacturer's model number: DP100
- CODE No.: 434-8559
Package size：45×30×130 mm 110 g [荷姿サイズについて]
アズワン品番 61-2212-41 型番 DP-100 JANコード 4571191312532 Standard price JPY: 11,588 USD: 72.64 Excange rate 1USD= 159.53JPY
Valid price in JapanQuantity 1piece Stock in Japan 
Supplier Stock
Product Variations (Different Sizes, Specifications, Optional Products, etc.)
商品イメージ アズワン品番 商品名 型番 Product categories
入り数 標準価格 標準価格(ドル) アズワン在庫
[サプライヤ在庫]
61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100 DP-100 Silicon (paste type) 1piece JPY: 11,588 USD: 72.64 
61-2212-33 Gel Sheet lambda gel hardness 45 COH-4000LVC0.5mm COH-4000LVC-T0.5 COH-4000LVC-T0.5 Silicon (sheet type) 1sheet JPY: 9,938 USD: 62.30 
61-2212-34 Gel Sheet lambda gel hardness 45 COH-4000LVC1.0mm COH-4000LVC-T1 COH-4000LVC-T1 Silicon (sheet type) 1sheet JPY: 16,813 USD: 105.39 
61-2212-35 Gel Sheet lambda gel hardness 45 COH-4000LVC2.0mm COH-4000LVC-T2 COH-4000LVC-T2 Silicon (sheet type) 1sheet JPY: 32,000 USD: 200.59 
61-2212-36 Gel Sheet lambda gel hardness 45 COH-4000LVC3.0mm COH-4000LVC-T3 COH-4000LVC-T3 Silicon (sheet type) 1sheet JPY: 45,700 USD: 286.47 This page is the page of Paste form thermal gel DP Series DP-100 6.5W/mK sold by AS ONE CORPORATION. AXEL GLOBAL is a website that lists more than 3 million products that are used in a wide range of fields, including Research and Development, Production,Semiconductor, Medicine, Nursing care, and Food sanitation.ASONEs="init">
61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100 【AXEL GLOBAL】<!--@[ss-27]@--> アズワン<!--@/[ss-27]@--> Contact us
Taica Corporation 61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100
Features
- Very soft heat-conducting gel.
- It achieves high thermal conductivity and exerts excellent effects on heat dissipation.
- It adheres to uneven surfaces with excellent flexibility and stickiness, and does not create an air layer on the contact surface.
- Excellent electrical insulation and flame retardancy.
- Can be used in a wide range of temperatures.
- Because the molecules are gently cross-linked, it is difficult to cause "dripping" or "vaporization."
- Heat dissipation inside a personal computer (CPU, board, etc.).
- Heat dissipation of power transistors and power supply components.
- Heat dissipation of semiconductor elements that generate heat such as electronic equipment.
- A gap around a heating element such as a high-density semiconductor device.
- Top, side, and lead wires of heating elements such as ICs.
- Heating point where sticking the sheet is difficult.
- Where there is no space for mounting the heat conductive material.
Spec
- Specific gravity: 2.8
- Operating temperature range (℃): -40 - 200
- Capacity (cc): 30
- Mass (G): 95
- Volume Resistivity (Ω ・ cm): 5. 9x10 ^ 13
- Insulation fracture strength (KV/cm mm): 5
- hardness (consistency) (1 10mm, mix): 51
- Conductivity: 6. 5W/m, K (measuring method), 2. 1W/m, K (hot wire method)
- silicon gel, Thermal conductivity filler
- Application: PC internal (CPU, board, etc). power transistor, Power parts. Electron equipment such as heat generation semiconductor element. high Density semiconductor elements of heater around the gap. IC such as heating elements of the top surface, the side surface and lead wire. Sheet pasting is difficult hot spots. thermal installation space the margins is not.
- Country of origin: Japan
- Weight: 95g
- * Please use [HA pre-tested"and corresponding Application to proper to check.
- * general industrial Application for developed. medical implant product for absolute use Do not.
- * various data is guaranteed value The. Also contents is performance improvement, Specification Changes for notice no change if.
- * usage by silicon raw material from Oil minutes but ooze it.
- * low minutes child siloxane" containing.
- Manufacturer's model number: DP100
- CODE No.: 434-8559
Package size：45×30×130 mm 110 g [About Package size]
Order No. 61-2212-41 Model No. DP-100 JAN Code 4571191312532 Standard price JPY: 11,588 USD: 72.64 Excange rate 1USD= 159.53JPY
Valid price in JapanQuantity 1piece Stock in Japan
Supplier Stock
Product Variations (Different Sizes, Specifications, Optional Products, etc.)
Product image Order No. Name Model No. Product categories
Quantity Standard price Valid price in Japan Stock
[Supplier Stock]61-2212-41 Paste form thermal gel DP Series DP-100 6.5W/mK DP-100 DP-100 Silicon (paste type) 1piece JPY: 11,588 USD: 72.64 61-2212-33 Gel Sheet lambda gel hardness 45 COH-4000LVC0.5mm COH-4000LVC-T0.5 COH-4000LVC-T0.5 Silicon (sheet type) 1sheet JPY: 9,938 USD: 62.30 61-2212-34 Gel Sheet lambda gel hardness 45 COH-4000LVC1.0mm COH-4000LVC-T1 COH-4000LVC-T1 Silicon (sheet type) 1sheet JPY: 16,813 USD: 105.39 61-2212-35 Gel Sheet lambda gel hardness 45 COH-4000LVC2.0mm COH-4000LVC-T2 COH-4000LVC-T2 Silicon (sheet type) 1sheet JPY: 32,000 USD: 200.59 61-2212-36 Gel Sheet lambda gel hardness 45 COH-4000LVC3.0mm COH-4000LVC-T3 COH-4000LVC-T3 Silicon (sheet type) 1sheet JPY: 45,700 USD: 286.47
