Features

Very soft heat conduction αGEL.
It has high thermal conductivity and provides excellent heat dissipation.
It adheres to uneven surfaces with excellent flexibility and stickiness, and does not create an air layer on the contact surface.
Excellent electrical insulation and flame retardancy.
Can be used in a wide range of temperatures.
It is flexible and has a high level of breakdown strength.
Heat dissipation inside a personal computer (CPU, board, etc.).
Heat dissipation of power transistors and power supply components.
Heat dissipation of semiconductor elements that generate heat such as electronic equipment.

Spec

Operating temperature range (℃): -40 - 150
Mass (G): 1350
Volume Resistivity (Ω ・ cm): 7. 1x10 13 ^
Insulation fracture strength (K V/mm): 12.5
Tensile Strength (MPa): 0.35
Growth (%): 68
Flame retardant of (UL94): 0
hardness (penetration 1 10mm): 45
Body Dimensions (mm) vertical x horizontal x Thickness: 400x400x3.0
Conductivity: 6. 5W/m, K (measuring method), 2. 1W/m, K (hot wire method)
silicon gel, Thermal conductivity filler
Application: PC internal (CPU, board, etc). power transistor, Power parts. Electron equipment such as heat generation semiconductor element.
Country of origin: Japan
Weight: 1350g
* Please use [HA pre-tested"and corresponding Application to proper to check.
* general industrial Application for developed. medical implant product for absolute use Do not.
* various data is guaranteed value The. Also contents is performance improvement, Specification Changes for notice no change if.
* usage by silicon raw material from Oil minutes but ooze it.
* low minutes child siloxane" containing.
Manufacturer's model number: COH4000LVCT3
CODE No.: 434-8508