61-0413-98 Lead Free Solder SWF-08
Features
- Exfoliation strength equivalent to conventional eutectic solder. Non-cleaning type solder with high performance yam.
- The flux residue is not corrosive at all, and cleaning of the substrate is not necessary.
- The residue has excellent non-hygroscopic and electrical insulation properties.
- It has good activity persistence and excellent wettability.
- Organic amine type special active rosin (non-chlorine type) is used.
- JIS-AA class, MIL-RMA standard compatible.
- For copper and copper alloy precision substrates.
Spec
- Wire diameter (mm): 0.8
- Length (m): 4.4
- Mass (g): 30
- Melting point: 217℃
- Flux: JIS AA class
- Alloy composition (tin: 96.5%, Silver 3%, Copper 0.5%)
- Flux: Organic amine based special activated rosin
- Application: for soldering work and etc. in a lead-free environment.
- Production country: Japan
- Weight: 14g
- Manufacturer's model number: SWF08
- Order code: 368-8593
Package size：40×170×23 mm 40 g [About Package size]
| Order No. | 61-0413-98 | |
|---|---|---|
| Model No. | SWF-08 | |
| JAN Code | 4989833042080 | |
| Standard price |
JPY: 1,800
USD: 11.20
Excange rate 1USD= 160.72JPY
Valid price in Japan |
|
| Quantity | 1piece | |
| Stock in Japan |
|
|
| Supplier Stock |
|
|
Product Variations (Different Sizes, Specifications, Optional Products, etc.)
| Product image | Order No. | Name | Model No. | Quantity | Standard price | Valid price in Japan | Stock [Supplier Stock] |
|
|---|---|---|---|---|---|---|---|---|
 |
61-0413-96 | Lead Free Solder SWF-03 | SWF-03 | 1piece | JPY: 9,500 | USD: 59.11 |
|
|
 |
61-0413-97 | Lead Free Solder SWF-06 | SWF-06 | 1piece | JPY: 1,680 | USD: 10.45 |
|
|
 |
61-0413-98 | Lead Free Solder SWF-08 | SWF-08 | 1piece | JPY: 1,800 | USD: 11.20 |
|
|
 |
61-0413-99 | Lead Free Solder SWF-10 | SWF-10 | 1piece | JPY: 2,300 | USD: 14.31 |
|