61-0413-96 Lead Free Solder SWF-03
Features
- Exfoliation strength equivalent to conventional eutectic solder. Non-cleaning type solder with high performance yam.
- The flux residue is not corrosive at all, and cleaning of the substrate is not necessary.
- The residue has excellent non-hygroscopic and electrical insulation properties.
- It has good activity persistence and excellent wettability.
- Organic amine type special active rosin (non-chlorine type) is used.
- JIS-AA class, MIL-RMA standard compatible.
- For copper and copper alloy precision substrates.
Spec
- Material: Sn96.5%, Ag3%, Cu0.5%
- Main unit size (width): 50mm
- Main unit size (depth): 50mm
- Main unit size (height): 20mm
- Body weight: 100g
Package size：50×50×23 mm 120 g [About Package size]
| Order No. | 61-0413-96 | |
|---|---|---|
| Model No. | SWF-03 | |
| JAN Code | 4989833042035 | |
| Standard price |
JPY: 9,500
USD: 59.59
Excange rate 1USD= 159.42JPY
Valid price in Japan |
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| Quantity | 1piece | |
| Stock in Japan |
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| Supplier Stock |
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Product Variations (Different Sizes, Specifications, Optional Products, etc.)
| Product image | Order No. | Name | Model No. | Quantity | Standard price | Valid price in Japan | Stock [Supplier Stock] |
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|---|---|---|---|---|---|---|---|---|
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61-0413-96 | Lead Free Solder SWF-03 | SWF-03 | 1piece | JPY: 9,500 | USD: 59.59 |
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61-0413-97 | Lead Free Solder SWF-06 | SWF-06 | 1piece | JPY: 1,680 | USD: 10.54 |
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61-0413-98 | Lead Free Solder SWF-08 | SWF-08 | 1piece | JPY: 1,800 | USD: 11.29 |
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61-0413-99 | Lead Free Solder SWF-10 | SWF-10 | 1piece | JPY: 2,300 | USD: 14.43 |
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