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• Material: Beryllium Copper
• Treatment: Nickel Underlay Gold Plating
• Contact resistance: 10 m.OMEGA. or less
• Current rating: 6A
• Number of insertions and removals: 100 or fewer
• Recommended metal mask thickness: 100 ~ 150 mu
• Compatible Printed Circuit Board Thickness: Available for all boards
• Operating temperature range: -40 to + 125 degrees C
• Compatible male pin value: 0.45 ~ 0.6 phi
• Insertion force (g or more): 100
• Pulling force (g or more): 70
• Packing: Roses: 100 pieces
• The through-hole hole can be transformed into a socket simply by automatically mounting the AF series on the through-hole hole with a mounter and reflowing. ・It can protect parts from heat rise caused by lead-free solder. ・Various parts (wire diameter 0.40 ~ 1.0 phi) can be attached.
• RoHS compliant
• Quantity: 1 bag (100 pieces)
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