Linkman

Universal Board One Side 72 x 47　LUPCB-7247S

It is a so-called "C substrate" size substrate. A solid pattern is available at one corner to help ground the chassis and ground GND. Since there are many holes, it can be used widely.
External View :-

Linkman

Universal Board Double-sided 72 x 47　LUPCB-7247W

It is a glass epoxy substrate of the same size as the so-called "C substrate" (72x47mm) with a double-sided through-hole finish. We also have a sister product [LUPCB -7247 S] with a single-sided board.
External View :-

OMRON Corporation

단일 회선 소켓(1 x 32핀)　XR2C3211N

2.54 mm pitch IC socket.
It is equivalent to a row of consecutive round-pin DIP sockets. Cut it to the required length. It is different from a square pin pin header.

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

TNF 유형 무연 범용 기판(SW -20 호환)

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

TNF 유형 무연 범용 기판(SS -90 호환)　TNF4366

Double-sided glass epoxy sulfole substrate suitable for Takachi SW-90 case. It's lead-free.

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

TNF 유형 무연 범용 기판(SS -160 호환)　TNF89136

Double-sided glass epoxy sulfole substrate suitable for Takachi SW-160 case. It's lead-free. It is also highly practical as a general-purpose substrate.

OMRON Corporation

단일 회선 소켓(1 x 20핀)　XR2C2011N

Round pin socket with 2.54 mm (0.1 inch) pitch. You can fold it at the break in the middle.
Package: ICS4

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

TNF 유형 무연 범용 기판(TW4 -2 -5 호환)

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

TNF 유형 무연 범용 기판(SW -65 호환)　TNF3959

Double-sided glass epoxy sulfole substrate suitable for Takachi SW-65 case. It's lead-free.

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

TNF 유형 무연 범용 기판(PW 15 -4 -11 호환)　TNF12299

Linkman

Round Pin IC Socket 18 Pin

Linkman

Round Pin IC Socket single Socket (40 Pin x 1 row)　21501*40E

For DIP ICs and round pins of the corresponding thickness.
Square pin headers such as 2130S1*40GSE are thick and do not fit. It is a pin socket that can be folded with a knot for each pin. Can also be used to replace IC sockets.

Linkman

Round Pin IC Socket 28 Pin　212128NE

Round pin IC socket for DIP (Dual In-Line Package) 28 pin (0.3 inch width). It is easy to insert and hard to remove, and it is more reliable when compared with a leaf spring.

Linkman

Round Pin IC Socket DIP 8 Pin　21218NE

Socket for 8-pin DIPIC. It is more reliable and more reliable than the leaf spring type. It is also combined with round pin header and connecting socket to DIP the board module.

Linkman

Round Pin IC Socket 14 Pin　212114NE

Round pin IC socket for 300mil 14 pin DIP-IC. It is easier to insert and harder to remove than a leaf spring and is highly reliable.

Linkman

Round Pin IC Socket 32 Pin　212132WE

Linkman

Round Pin IC Socket 16 Pin　212116NE

Round pin IC socket for 300mil 16 pin DIP-IC. Compared to the leaf spring type, it is easier to insert and harder to remove and is highly reliable.

Linkman

Flat Spring type IC Socket 8-Pin　21208NE

Socket for inserting a 300mil (0.3inch) wide 8 pin DIP-IC. Features an inexpensive contact with a leaf spring.
Package: ICS1

Linkman

Flat Spring type IC Socket 14 Pin　212014NE

Leaf spring type IC socket for attaching 300mil 14 pin DIP-IC.
Package: ICS1

Linkman

IC Socket leaf Spring 16 Pin　212016NE

300mil 16 pin DIP-IC socket.
Package: ICS1

Linkman

Round Pin IC Socket 24 Pin　212124NE

Linkman

Round Pin IC Socket 28 Pin　212128WE

Linkman

PLCC Socket 84 Pin　211084TS

Linkman

Round Pin IC Socket 24 Pin　212124WE

Linkman

Round Pin IC Socket 42 Pin　212142WE

Linkman

Universal Socket 24 Pin　ELK324

Linkman

Leaf Spring IC Socket 18 Pin

Linkman

Universal Substrate 71.23 x 95.25 One Side　LUPCB-9572S-R2

This is a single-sided universal substrate equivalent to the so-called "B" substrate. There is a hole with a pitch of 2.54 mm. One of the corner mounting holes can be a solid pattern to share the chassis and ground.

Linkman

Universal Substrate 71.23 x 95.25 Two Sides　LUPCB-9572W-R2

It is a double-sided universal board equivalent to a B board. 2.54 mm pitch dot pattern. The material is glass epoxy (Gala Epo) which is higher grade than bake.

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

TNF 유형 무연 범용 기판(SY -150 호환)

OMRON Corporation

라운드 핀 IC 소켓 8핀

OMRON Corporation

핀 IC 소켓 32핀

RS PRO

RS PRO 2.54mm 피치 14 웨이, 관통 구멍 마운트 PCB 헤더, 니켈 위의 주석, 1A　402-658

RS Pro Grooved Headers
The RS Pro grooved dual inline (DIL) header series is designed to simplify assembly of subassemblies and modules used as carrier systems. These headers can also be used with the appropriate DIL socket to create a plug/socket pair for multipole connections, or soldered directly to the board. All models boast high reliability and excellent quality.

RS PRO

RS PRO 2.54mm 피치 20 웨이, 관통 구멍 마운트 PCB 헤더, 니켈 위의 주석, 1A　402-670

RS Pro Grooved Headers
The RS Pro grooved dual inline (DIL) header series is designed to simplify assembly of subassemblies and modules used as carrier systems. These headers can also be used with the appropriate DIL socket to create a plug/socket pair for multipole connections, or soldered directly to the board. All models boast high reliability and excellent quality.

RS PRO

RS PRO 2.54mm 피치 40 웨이, 관통 구멍 마운트 PCB 헤더, 니켈 위의 주석, 1A　402-692

RS Pro Grooved Headers
The RS Pro grooved dual inline (DIL) header series is designed to simplify assembly of subassemblies and modules used as carrier systems. These headers can also be used with the appropriate DIL socket to create a plug/socket pair for multipole connections, or soldered directly to the board. All models boast high reliability and excellent quality.

Winslow

Winslow Straight Through Hole Mount 1.27mm, 2.54mm Pitch IC 소켓 어댑터, 8핀 암 SOP ~ 8핀 수 DIP　W9501RC

SOIC - DIP 소켓. SOIC(Small Outline ICs)를 DIP(Dual In Line) 패키지 형식으로 변환하는 Adaptics입니다. PCB: 에폭시 섬유 유리 FR4

Winslow

Winslow Straight Through Hole Mount 1.27mm, 2.54mm Pitch IC 소켓 어댑터, 14핀 암컷 SOP에서 14핀 수컷 DIP　W9502RC

SOIC - DIP 소켓. SOIC(Small Outline ICs)를 DIP(Dual In Line) 패키지 형식으로 변환하는 Adaptics입니다. PCB: 에폭시 섬유 유리 FR4

Winslow

Winslow Straight Through Hole Mount 1.27mm, 2.54mm Pitch IC 소켓 어댑터, 16핀 암컷 SOP에서 16핀 수컷 DIP　W9503RC

SOIC - DIP 소켓. SOIC(Small Outline ICs)를 DIP(Dual In Line) 패키지 형식으로 변환하는 Adaptics입니다. PCB: 에폭시 섬유 유리 FR4

Winslow

Winslow 2.54mm Pitch Vertical 16Way, Through Hole Turn Pin Open Frame IC Dip 소켓, 5A　W30616T3RC

Winslow Adaptics W30600 시리즈 와이어 랩 DIL IC 소켓. W30600 시리즈 레벨 3 와이어 랩 DIL IC 소켓은 오픈 프레임 하우징으로 구성됩니다. 이러한 DIL IC 소켓은 베릴륨 구리 접촉과 함께 나사 가공(회전)된 절반 하드 황동 외부 핀을 가집니다. 접촉부는 금 도금되고 외부 핀은 순수한 밝은 주석 도금을 가집니다. 이러한 와이어 랩 DIL IC 소켓의 핀은 직선 널링형 배럴을 특징으로 하여 래핑 프로세스 동안 핀이 회전하지 않도록 합니다. 프레임은 UL 94 V-0 등급을 가진 PBT로 만들어집니다. 기능 및 이점 핀 회전을 방지하기 위해 나사가공된 면밀통

Winslow

Winslow 2.54mm Pitch Vertical 20 Way, Through Hole Turned Pin Open Frame IC Dip 소켓, 5A　W30620T3RC

Winslow Adaptics W30600 시리즈 와이어 랩 DIL IC 소켓. W30600 시리즈 레벨 3 와이어 랩 DIL IC 소켓은 오픈 프레임 하우징으로 구성됩니다. 이러한 DIL IC 소켓은 베릴륨 구리 접촉과 함께 나사 가공(회전)된 절반 하드 황동 외부 핀을 가집니다. 접촉부는 금 도금되고 외부 핀은 순수한 밝은 주석 도금을 가집니다. 이러한 와이어 랩 DIL IC 소켓의 핀은 직선 널링형 배럴을 특징으로 하여 래핑 프로세스 동안 핀이 회전하지 않도록 합니다. 프레임은 UL 94 V-0 등급을 가진 PBT로 만들어집니다. 기능 및 이점 핀 회전을 방지하기 위해 나사가공된 면밀통