67-7974-13 Electrolytic Copper Foil Tape (Thin Product) CU-19ST 19.0 mm CU-19ST
기능
- Flexible for easy winding and sticking work.
- Since conductive adhesive is used, it does not reduce the shielding effect.
- Metal foil can be soldered.
- Thin product of 53 μm thickness.
- UL510 (FR) certified product.
- [Application]
- Grounding and shielding of the housing
- Grounding and shielding of Cable harness and Connector terminal
- EMI Shield Room
- Suitable as an emergency measure when measuring shield characteristics
사양
- Width: 19.0 mm
- Length: 50 m
- Metal foil thickness: 18 μm
- Adhesive thickness: 35 μm
- Total product thickness: 53 μm
- Adhesive Force: 10 N or More/25 mm (180° Peel vs. SUS)
- Contact Resistance Value: 0.002 Ω/25 mm□19.6 N)
- Flame Retardant: UL510FR
패키지 크기：150×150×19 mm 340 g [패키지 크기 정보]
| 주문 번호 | 67-7974-13 | |
|---|---|---|
| 모델 번호 | CU-19ST | |
| 표준 가격 |
JPY: 11,100
USD: 69.58
Excange rate 1USD= 159.53JPY
Valid price in Japan |
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| 수량 | 1piece | |
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| 공급자 재고 |
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다양한 상품군(多樣한) (다른 사이즈,다른 사양,옵션등)
| 제품 이미지 | 주문 번호 | 이름 | 모델 번호 | 수량 | 표준 가격 | 일본에서의 유효 가격 | 재고 [공급자 재고] |
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|---|---|---|---|---|---|---|---|---|
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67-7974-11 | Electrolytic Copper Foil Tape (Thin Product) CU-8ST 8.0 mm CU-8ST | CU-8ST | 1piece | JPY: 5,300 | USD: 33.22 |
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67-7974-12 | Electrolytic Copper Foil Tape (Thin Product) CU-13ST 13.0 mm CU-13ST | CU-13ST | 1piece | JPY: 8,100 | USD: 50.77 |
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67-7974-13 | Electrolytic Copper Foil Tape (Thin Product) CU-19ST 19.0 mm CU-19ST | CU-19ST | 1piece | JPY: 11,100 | USD: 69.58 |
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67-7974-14 | Electrolytic Copper Foil Tape (Thin Product) CU-25ST 25.0 mm CU-25ST | CU-25ST | 1piece | JPY: 13,800 | USD: 86.50 |
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67-7974-15 | Electrolytic Copper Foil Tape (Thin Product) CU-50ST 50.0 mm CU-50ST | CU-50ST | 1piece | JPY: 25,700 | USD: 161.10 |
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67-7974-16 | Electrolytic Copper Foil Tape (Thin Product) CU-100ST 100.0 mm CU-100ST | CU-100ST | 1piece | JPY: 52,400 | USD: 328.47 |
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제품 카탈로그
| 카탈로그 이름 | 페이지 |
|---|---|
| AS ONE Catalog 2025 [Instruments for Laboratory] | 2014 |