사양

• Size: 114 x 114 x 0.32 mm
• Surface roughness: ≤0.8 Ra
• Specific gravity: 3.20± 0.05 g/cm3
• Elastic modulus: 300~320Gpa
• Poisson's ratio: ≤0.29 - Vickers hardness ≥14.2Gpa
• Coefficient of linear thermal expansion (25 °C - 500 °C): 3.0~3.2 10-6/°C
• Fracture toughness: 6.0~7.0 MPa
• three point bending: 700~800 Mpa
• Thermal conductivity (25 °C): ≥85 W/(m · k)
• Quantity: 1 (1 box)
• *custom-made product
• The azimuth (cutting angle), OF azimuth angle tolerance, and thickness tolerance can be reduced and processed with high precision, enabling accurate groove formation in etching.
• Various shape processing and surface treatment are possible (Examples: Counterbore, Drilling, Oxidized Wafer).
• Suitable for desired resistivity and wafer thickness.
• *Although this product is manufactured and processed using crystalline materials for semiconductors, it is not possible to certify the purity of the materials.
• *Please coordinate with the supplier in case of special order.
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