사양

• 4-inch LN wafer
• Crystal orientation: Z axis
• Thickness: 500±25 μm
• Face Condition: Double-Sided Polished
• Quantity: 1 (1 box)
• *custom-made product
• The azimuth (cutting angle), OF azimuth angle tolerance, and thickness tolerance can be reduced and processed with high precision, enabling accurate groove formation during etching.
• Various shapes and surface treatments are possible (Examples: gouging, drilling, wafer with oxide film).
• It is possible to match the specific resistivity and wafer thickness you desire.
• *Although this product is manufactured and processed using crystal materials for semiconductors, it is not possible to verify the purity of the material.
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