기능

• Material: Beryllium Copper
• Treatment: Nickel base gold plating
• Contact resistance: 10 mΩ or less
• Rated current: 2 A
• Number of insertions and insertions: 100 times or less
• Recommended metal mask thickness: 100~150μ
• Applicable printed circuit board thickness: Applicable to all foundations
• Operating temperature range: -40 to +125°C
• Applicable male pin value: 0.45~0.6φ
• Insertion force (g or more): 250
• Removal force (g or more): 130
• Packing condition: Roses: 100 pcs.
• Through hole holes can be transformed into sockets simply by automatically mounting the AF series on the mounter and reflow. ・Protects parts from heat rise caused by lead-free solder. ・Various parts (wire diameter 0.40~1.0φ) can be installed.