SIGMAKOKI CO., LTD.

61-6875-62 얇은 판 빔 분리기 0.09±0.01mm MPSMH-30C0.09-1-550

기능

  • This is a beam splitter that reduces the thickness of the substrate to the extreme.
  • Reflected light can be extracted without affecting the beam shift or wavelength dispersion of transmitted light when inserted into the optical path.
  • Two types of glass substrates, 300 μm and 90 μm in thickness, are available.
  • The substrate is coated with a dielectric multilayer film that branches transmission and reflection 1:1.
  • The surface is coated with a dielectric multilayer film and the back is coated with an anti-reflection film, resulting in little loss of light.
  • The thin glass substrate is firmly fixed to the holding glass, which is less affected by thermal expansion.
  • Unlike pellicles, synthetic quartz is thinly processed, so it has excellent durability and vibration resistance.
  • * Since the glass substrate of the plate thin beam splitter is very thin, it will be damaged only by light force.
  • * Handle with care.
  • * If dust arrives on the surface of the device, it cannot be wiped with lens paper, etc.
  • * Use an air blower to blow away the garbage.
  • * When linearly polarized light such as laser light is used, the reflectivity and transmittance vary depending on the polarization direction.
  • * When strictly adjusting the branching ratio to 1:1, tilt the polarization azimuth to 45 degrees or use circularly polarized light.
  • * Transmittance wavelength characteristics change when used at an incidence angle other than 45 degrees.
  • * The reflecting surface may be distorted when the holding glass is pressed tightly.
  • * When fixing, be sure to support only the outer frame.
  • * The surface accuracy of the reflecting surface may deteriorate when the camera is used in an environment where temperature changes rapidly.
  • * The phase difference of the incident light is not stored in transmitted light or reflected light.
  • * Use a wave plate to compensate for the phase difference.

사양

  • [ > 박판형 빔 분리기 < 공통 사양]
  • 자료: 인조수정
  • 코팅: 표면 유전체 다층 필름, 후면(45° 테이퍼 홀 측면) 반사 방지 필름
  • 입사각: 화씨 45도
  • 투과율: 평균 50 ±5%(P편광과 S편광의 평균값)
  • 분기 비율(반사: 전송): 1: 1개
  • 스크래치 - 굴착: 40-20
  • 유효 지름: 위10밀리미터
  • 프레임 자료: 유리 합성 석영, 외부 프레임 알루미늄 표면 처리 매트 블랙 양극산화물
  • [개별 사양]
  • 적응 파장: 400 - 700nm
  • 요소 두께: 0.09±0.01mm
  • 코팅 후 표면 정확도: 리플렉션: 광연마 전송: 광연마
  • RoHS 제품 준수
  •  
주문 번호 61-6875-62
모델 번호 MPSMH-30C0.09-1-550
표준 가격 JPY: 62,700 USD: 390.12
Excange rate 1USD= 160.72JPY
Valid price in Japan
수량 1piece
일본의 주식
공급자 재고

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제품 이미지 주문 번호 이름 모델 번호 수량 표준 가격 일본에서의 유효 가격 재고
[공급자 재고]
61-6875-61 얇은 판 빔 분리기 0.3±0.03mm MPSMH-30C0.3-1-550 MPSMH-30C0.3-1-550 1piece JPY: 62,700 USD: 390.12

61-6875-62 얇은 판 빔 분리기 0.09±0.01mm MPSMH-30C0.09-1-550 MPSMH-30C0.09-1-550 1piece JPY: 62,700 USD: 390.12