60-9846-99 Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ0.6 mm 10 m FS521-061001
기능
- It is a lead-free solder recommended by JEITA* and has been used since the introduction of lead-free solder. It has been adopted in many manufacturing sites.
- *Japan Electronics and Information Technology Industries Association
사양
- thread solder
- lead-free solder
- Composition: Sn-3.0Ag-0.5Cu
- Melting point: 217~220°C
- Wire Diameter: Φ0.6 mm
- flux cored
- Content: 10 m roll
패키지 크기：95×29×130 mm 30 g [패키지 크기 정보]
| 주문 번호 | 60-9846-99 | |
|---|---|---|
| 모델 번호 | FS521-061001 | |
| JAN 코드 | 4962615065859 | |
| 표준 가격 |
JPY: 1,670
USD: 10.47
Excange rate 1USD= 159.53JPY
Valid price in Japan |
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| 수량 | 1piece | |
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다양한 상품군(多樣한) (다른 사이즈,다른 사양,옵션등)
| 제품 이미지 | 주문 번호 | 이름 | 모델 번호 | 수량 | 표준 가격 | 일본에서의 유효 가격 | 재고 [공급자 재고] |
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60-9846-98 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ0.3 mm 10 m FS521-031001 | FS521-031001 | 1piece | JPY: 890 | USD: 5.58 |
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60-9846-99 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ0.6 mm 10 m FS521-061001 | FS521-061001 | 1piece | JPY: 1,670 | USD: 10.47 |
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60-9847-01 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ0.8 mm 10 m FS521-081001 | FS521-081001 | 1piece | JPY: 2,500 | USD: 15.67 |
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60-9847-02 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ1.0 mm 10 m FS521-101001 | FS521-101001 | 1piece | JPY: 3,600 | USD: 22.57 |
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60-9847-03 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ1.2 mm 10 m FS521-121001 | FS521-121001 | 1piece | JPY: 5,020 | USD: 31.47 |
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60-9847-04 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ1.6 mm 10 m FS521-161001 | FS521-161001 | 1piece | JPY: 8,670 | USD: 54.35 |
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