Linkman

Universal Board One Side 72 x 47　LUPCB-7247S

It is a so-called "C substrate" size substrate. A solid pattern is available at one corner to help ground the chassis and ground GND. Since there are many holes, it can be used widely.
External View :-

Linkman

Universal Board Double-sided 72 x 47　LUPCB-7247W

It is a glass epoxy substrate of the same size as the so-called "C substrate" (72x47mm) with a double-sided through-hole finish. We also have a sister product [LUPCB -7247 S] with a single-sided board.
External View :-

OMRON Corporation

Soket garis-tunggal (1 x 32 pin)　XR2C3211N

2.54 mm pitch IC socket.
It is equivalent to a row of consecutive round-pin DIP sockets. Cut it to the required length. It is different from a square pin pin header.

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

Substrat universal bebas-prospek TNF (SW -20 Sesuai)

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

Substrat universal bebas-prospek tipe TNF (kesesuaian SS-90)　TNF4366

Double-sided glass epoxy sulfole substrate suitable for Takachi SW-90 case. It's lead-free.

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

Substrat universal bebas-prospek TNF (kesesuaian SS-160)　TNF89136

Double-sided glass epoxy sulfole substrate suitable for Takachi SW-160 case. It's lead-free. It is also highly practical as a general-purpose substrate.

OMRON Corporation

Soket garis-tunggal (1 x 20 pin)　XR2C2011N

Round pin socket with 2.54 mm (0.1 inch) pitch. You can fold it at the break in the middle.
Package: ICS4

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

Substrat universal bebas-prospek tipe TNF (TW4 -2 -5 Sesuai)

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

Tipe TNF memungkinkan substrat universal (SW -65 Sesuai)　TNF3959

Double-sided glass epoxy sulfole substrate suitable for Takachi SW-65 case. It's lead-free.

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

Substrat universal bebas-prospek TNF (PW 15-4-11 Sesuai)　TNF12299

Linkman

Round Pin IC Socket 18 Pin

Linkman

Round Pin IC Socket single Socket (40 Pin x 1 row)　21501*40E

For DIP ICs and round pins of the corresponding thickness.
Square pin headers such as 2130S1*40GSE are thick and do not fit. It is a pin socket that can be folded with a knot for each pin. Can also be used to replace IC sockets.

Linkman

Round Pin IC Socket 28 Pin　212128NE

Round pin IC socket for DIP (Dual In-Line Package) 28 pin (0.3 inch width). It is easy to insert and hard to remove, and it is more reliable when compared with a leaf spring.

Linkman

Round Pin IC Socket DIP 8 Pin　21218NE

Socket for 8-pin DIPIC. It is more reliable and more reliable than the leaf spring type. It is also combined with round pin header and connecting socket to DIP the board module.

Linkman

Round Pin IC Socket 14 Pin　212114NE

Round pin IC socket for 300mil 14 pin DIP-IC. It is easier to insert and harder to remove than a leaf spring and is highly reliable.

Linkman

Round Pin IC Socket 32 Pin　212132WE

Linkman

Round Pin IC Socket 16 Pin　212116NE

Round pin IC socket for 300mil 16 pin DIP-IC. Compared to the leaf spring type, it is easier to insert and harder to remove and is highly reliable.

Linkman

Flat Spring type IC Socket 8-Pin　21208NE

Socket for inserting a 300mil (0.3inch) wide 8 pin DIP-IC. Features an inexpensive contact with a leaf spring.
Package: ICS1

Linkman

Flat Spring type IC Socket 14 Pin　212014NE

Leaf spring type IC socket for attaching 300mil 14 pin DIP-IC.
Package: ICS1

Linkman

IC Socket leaf Spring 16 Pin　212016NE

300mil 16 pin DIP-IC socket.
Package: ICS1

Linkman

Round Pin IC Socket 24 Pin　212124NE

Linkman

Round Pin IC Socket 28 Pin　212128WE

Linkman

PLCC Socket 84 Pin　211084TS

Linkman

Round Pin IC Socket 24 Pin　212124WE

Linkman

Round Pin IC Socket 42 Pin　212142WE

Linkman

Universal Socket 24 Pin　ELK324

Linkman

Leaf Spring IC Socket 18 Pin

Linkman

Universal Substrate 71.23 x 95.25 One Side　LUPCB-9572S-R2

This is a single-sided universal substrate equivalent to the so-called "B" substrate. There is a hole with a pitch of 2.54 mm. One of the corner mounting holes can be a solid pattern to share the chassis and ground.

Linkman

Universal Substrate 71.23 x 95.25 Two Sides　LUPCB-9572W-R2

It is a double-sided universal board equivalent to a B board. 2.54 mm pitch dot pattern. The material is glass epoxy (Gala Epo) which is higher grade than bake.

TAKACHI ELECTRONICS ENCLOSURE Co., Ltd.

Substrat universal bebas-prospek TNF (kompatibel SY-150)

OMRON Corporation

Pin bulat IC Socket 8

OMRON Corporation

pin IC Socket-32

RS PRO

RS PRO 2,54 mm Pitch 14 Way, Melalui Hole Mount PCB Header, Tin over Nickel, 1A　402-658

RS Pro Grooved Headers
The RS Pro grooved dual inline (DIL) header series is designed to simplify assembly of subassemblies and modules used as carrier systems. These headers can also be used with the appropriate DIL socket to create a plug/socket pair for multipole connections, or soldered directly to the board. All models boast high reliability and excellent quality.

RS PRO

RS PRO 2,54 mm Pitch 20 Way, Melalui Hole Mount PCB Header, Tin over Nickel, 1A　402-670

RS Pro Grooved Headers
The RS Pro grooved dual inline (DIL) header series is designed to simplify assembly of subassemblies and modules used as carrier systems. These headers can also be used with the appropriate DIL socket to create a plug/socket pair for multipole connections, or soldered directly to the board. All models boast high reliability and excellent quality.

RS PRO

RS PRO 2,54 mm Pitch 40 Way, Melalui Hole Mount PCB Header, Tin over Nickel, 1A　402-692

RS Pro Grooved Headers
The RS Pro grooved dual inline (DIL) header series is designed to simplify assembly of subassemblies and modules used as carrier systems. These headers can also be used with the appropriate DIL socket to create a plug/socket pair for multipole connections, or soldered directly to the board. All models boast high reliability and excellent quality.

Winslow

Winslow Lurus Melalui Hole Mount 1,27 mm, 2.54 mm Pitch IC Socket Adapter, 8 Pin Wanita SOP ke 8 Pin DIP Pria　W9501RC

SOIC to DIP Sockets. Adaptika ' yang akan mengkonversi Small Outline IC (SOIC) ke dual dalam format paket (DIP) garis. PCB: Epoxy Fiberglass FR4

Winslow

Winslow Lurus Melalui Hole Mount 1,27 mm, 2.54 mm Pitch IC Socket Adapter, 14 Pin Wanita SOP ke 14 Pin DIP Pria　W9502RC

SOIC to DIP Sockets. Adaptika ' yang akan mengkonversi Small Outline IC (SOIC) ke dual dalam format paket (DIP) garis. PCB: Epoxy Fiberglass FR4

Winslow

Winslow Lurus Melalui Hole Mount 1,27 mm, 2.54 mm Pitch IC Socket Adapter, 16 Pin Wanita SOP ke 16 Pin Male DIP　W9503RC

SOIC to DIP Sockets. Adaptika ' yang akan mengkonversi Small Outline IC (SOIC) ke dual dalam format paket (DIP) garis. PCB: Epoxy Fiberglass FR4

Winslow

Winslow 2.54mm Pitch Vertikal 16 Cara, Melalui Lubang Menyalakan Pin Buka Bingkai Dip Socket, 5A　W30616T3RC

Wire Adaptics seri Winslow W30600 Wire Bungkus DIL Sockets IC. W30600 Seri Level 3 bungkus kawat diL IC soket dengan bingkai terbuka perumahan. Soket DIL IC ini telah mesin sekrup (berputar) setengah pin luar keras dengan kontak tembaga beryllium. Kontak adalah emas plated dan pins luar memiliki sebuah lempengan timah murni. Pin dari soket kawat diL IC memprakarsai sebuah barel perampas yang mencegah pin berputar selama proses pembungkusan. Bingkai tersebut bersumber dari PBT dengan rating UL 94 V-0. Fitur dan Manfaat. Sekrup kontak mesin Knurled barel untuk mencegah rotasi pin

Winslow

Winslow 2.54mm Pitch Vertical 20 Arah, Melalui Lubang Menyalakan Pin Buka Bingkai Dip Socket, 5A　W30620T3RC

Wire Adaptics seri Winslow W30600 Wire Bungkus DIL Sockets IC. W30600 Seri Level 3 bungkus kawat diL IC soket dengan bingkai terbuka perumahan. Soket DIL IC ini telah mesin sekrup (berputar) setengah pin luar keras dengan kontak tembaga beryllium. Kontak adalah emas plated dan pins luar memiliki sebuah lempengan timah murni. Pin dari soket kawat diL IC memprakarsai sebuah barel perampas yang mencegah pin berputar selama proses pembungkusan. Bingkai tersebut bersumber dari PBT dengan rating UL 94 V-0. Fitur dan Manfaat. Sekrup kontak mesin Knurled barel untuk mencegah rotasi pin