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Syfer Technology 1206 (3216M) 1nF MLCC 2kV dc ±10% SMD 1206Y2K00102KXT 1206Y2K00102KXT
Syfer Flexicap 1206. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,100
USD: 6.90
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Syfer Technology 0805 (2012M) 100nF MLCC 50V dc ±5% SMD 0805Y0500104JXT 0805Y0500104JXT
Syfer Flexicap 0805. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 950
USD: 5.96
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Syfer Technology 2220 (5650M) 1nF MLCC 4kV dc ±5% SMD 2220Y4K00102JXT 2220Y4K00102JXT
Syfer Flexicap 2220. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,800
USD: 11.29
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Syfer Technology 0603 (1608M) 0.3pF MLCC 250V dc ±0.1pF SMD 0603J250P300BQT 0603J250P300BQT
Syfer High Q Dielectric Multilayer. The Syfer MS range offers a very stable, High Q material system that provides excellent, low loss performance in systems below 3GHz Various termination options including FlexiCap™ High frequency capacitors suitable for many applications where economical, high performance is required
1 products found
JPY: 4,050
USD: 25.41
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Syfer Technology 1812 (4532M) 220nF MLCC 500V dc ±5% SMD 1812J5000224KXT 1812J5000224KXT
Syfer MLCC 1812. Suitable for all general purpose and high reliability applications All are manufactured using Syfer s unique wet process and incorporate precious metal electrodes
1 products found
JPY: 1,180
USD: 7.40
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Syfer Technology 1206 (3216M) 150pF MLCC 1kV dc ±5% SMD 1206J1K00151KXT 1206J1K00151KXT
Syfer MLCC 1206. Suitable for all general purpose and high reliability applications All are manufactured using Syfer s unique wet process and incorporate precious metal electrodes
1 products found
JPY: 1,040
USD: 6.52
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Syfer Technology 1206 (3216M) 100nF MLCC 100V dc ±10% SMD 1206Y1000104KXT 1206Y1000104KXT
Syfer Flexicap 1206. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 143,000
USD: 897.00
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Syfer Technology 0805 (2012M) 470pF MLCC 50V dc ±20% SMD 0805Y0500471MXT 0805Y0500471MXT
Syfer Flexicap 0805. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 123,000
USD: 771.55
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Syfer Technology 0805 (2012M) 100nF MLCC 50V dc ±5% SMD 0805Y0500104JXT 0805Y0500104JXT
Syfer Flexicap 0805. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 166,000
USD: 1,041.28
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Syfer Technology 0603 (1608M) 10nF MLCC 100V dc ±10% SMD 0603Y1000103KXT 0603Y1000103KXT
Syfer Flexicap 0603. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 124,000
USD: 777.82
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Syfer Technology 2220 (5650M) 1nF MLCC 4kV dc ±5% SMD 2220Y4K00102JXT 2220Y4K00102JXT
Syfer Flexicap 2220. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 196,000
USD: 1,229.46
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Syfer Technology 1812 (4532M) 27nF MLCC 250V dc ±5% SMD 1812YA250273JXT 1812YA250273JXT
Syfer 250Vac non safety Flexicap. Provides a solution for use at up to 250Vac 60Hz continuous use and provides for non safety-critical applications
1 products found
JPY: 317,000
USD: 1,988.46
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Syfer Technology 1210 (3225M) 1nF MLCC 100V dc ±5% SMD 1210Y1000102JCT 1210Y1000102JCT
Syfer Flexicap 1210. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,360
USD: 8.53
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Syfer Technology 1210 (3225M) 2.2nF MLCC 200V dc ±5% SMD 1210Y2000222JCT 1210Y2000222JCT
Syfer Flexicap 1210. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,360
USD: 8.53
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Syfer Technology 1210 (3225M) 100nF MLCC 200V dc ±10% SMD 1210Y2000104KXT 1210Y2000104KXT
Syfer Flexicap 1210. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,000
USD: 6.27
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Syfer Technology 1210 (3225M) 4.7nF MLCC 1.5kV dc ±10% SMD 1210Y1K50472KXT 1210Y1K50472KXT
Syfer Flexicap 1210. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,380
USD: 8.66
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Syfer Technology 1206 (3216M) 1μF MLCC 16V dc ±20% SMD 1206Y0160105MXT 1206Y0160105MXT
Syfer Flexicap 1206. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 6,660
USD: 41.78
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Syfer Technology 1206 (3216M) 100nF MLCC 100V dc ±10% SMD 1206Y1000104KXT 1206Y1000104KXT
Syfer Flexicap 1206. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 860
USD: 5.40
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Syfer Technology 1206 (3216M) 2.2nF MLCC 1.5kV dc ±10% SMD 1206Y1K50222KXT 1206Y1K50222KXT
Syfer Flexicap 1206. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,440
USD: 9.03
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Syfer Technology 0805 (2012M) 220pF MLCC 500V dc ±5% SMD 0805Y5000221JCT 0805Y5000221JCT
Syfer Flexicap 0805. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 960
USD: 6.02
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Syfer Technology 0805 (2012M) 470pF MLCC 50V dc ±20% SMD 0805Y0500471MXT 0805Y0500471MXT
Syfer Flexicap 0805. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 980
USD: 6.15
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Syfer Technology 0805 (2012M) 4.7nF MLCC 200V dc ±10% SMD 0805Y2000472KXT 0805Y2000472KXT
Syfer Flexicap 0805. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 990
USD: 6.21
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Syfer Technology 0603 (1608M) 22pF MLCC 100V dc ±5% SMD 0603Y1000220JCT 0603Y1000220JCT
Syfer Flexicap 0603. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 740
USD: 4.64
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Syfer Technology 0603 (1608M) 10nF MLCC 50V dc ±10% SMD 0603Y0500103KXT 0603Y0500103KXT
Syfer Flexicap 0603. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 500
USD: 3.14
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Syfer Technology 0603 (1608M) 150pF MLCC 100V dc ±10% SMD 0603Y1000151KXT 0603Y1000151KXT
Syfer Flexicap 0603. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 470
USD: 2.95
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Syfer Technology 0603 (1608M) 3.3nF MLCC 100V dc ±10% SMD 0603Y1000332KXT 0603Y1000332KXT
Syfer Flexicap 0603. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 740
USD: 4.64
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Syfer Technology 0603 (1608M) 10nF MLCC 100V dc ±10% SMD 0603Y1000103KXT 0603Y1000103KXT
Syfer Flexicap 0603. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 680
USD: 4.27
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Syfer Technology 0603 (1608M) 150pF MLCC 200V dc ±10% SMD 0603Y2000151KXT 0603Y2000151KXT
Syfer Flexicap 0603. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 500
USD: 3.14
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Syfer Technology 0603 (1608M) 680pF MLCC 200V dc ±10% SMD 0603Y2000681KXT 0603Y2000681KXT
Syfer Flexicap 0603. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 740
USD: 4.64
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Syfer Technology 1812 (4532M) 330nF MLCC 50V dc ±10% SMD 1812Y0500334KXT 1812Y0500334KXT
Syfer Flexicap 1812. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,080
USD: 6.78
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Syfer Technology 1812 (4532M) 100nF MLCC 500V dc ±10% SMD 1812Y5000104KXT 1812Y5000104KXT
Syfer Flexicap 1812. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,000
USD: 6.27
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Syfer Technology 1812 (4532M) 220nF MLCC 500V dc ±10% SMD 1812Y5000224KXT 1812Y5000224KXT
Syfer Flexicap 1812. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,000
USD: 6.27
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Syfer Technology 1111 (2828M) 1.5pF MLCC 1kV dc ±0.25pF SMD 1111J1K01P50CQT 1111J1K01P50CQT
Syfer High Q Dielectric Multilayer. The Syfer MS range offers a very stable, High Q material system that provides excellent, low loss performance in systems below 3GHz Various termination options including FlexiCap™ High frequency capacitors suitable for many applications where economical, high performance is required
1 products found
JPY: 630
USD: 3.95
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Syfer Technology 1812 (4532M) 27nF MLCC 250V dc ±5% SMD 1812YA250273JXT 1812YA250273JXT
Syfer 250Vac non safety Flexicap. Provides a solution for use at up to 250Vac 60Hz continuous use and provides for non safety-critical applications
1 products found
JPY: 4,240
USD: 26.60
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Syfer Technology 1812 (4532M) 1nF MLCC 2kV dc ±5% SMD 1812J2K00102KXT 1812J2K00102KXT
Syfer MLCC 1812. Suitable for all general purpose and high reliability applications All are manufactured using Syfer s unique wet process and incorporate precious metal electrodes
1 products found
JPY: 2,540
USD: 15.93
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［Discontinued］Syfer Technology 1206 (3216M) 470pF MLCC 1kV dc ±10% SMD 1206Y1K00471KXT 1206Y1K00471KXT
Syfer Flexicap 1206. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 530
USD: 3.33
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［Discontinued］Syfer Technology 0603 (1608M) 1nF MLCC 25V dc ±5% SMD 0603Y0250102JCT 0603Y0250102JCT
Syfer Flexicap 0603. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 440
USD: 2.76
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［Discontinued］Syfer Technology 1808 (4520M) 100pF MLCC 5kV dc ±5% SMD 1808Y5K00101JXT 1808Y5K00101JXT
Syfer Flexicap 1808. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,930
USD: 12.11
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［Discontinued］Syfer Technology 1210 (3225M) 100pF MLCC 1kV dc ±5% SMD 1210J1K00101JCT 1210J1K00101JCT
Syfer MLCC 1210. Suitable for all general purpose and high reliability applications All are manufactured using Syfer s unique wet process and incorporate precious metal electrodes
1 products found
JPY: 660
USD: 4.14
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［Discontinued］Syfer Technology 1210 (3225M) 220nF MLCC 100V dc ±10% SMD 1210Y1000224KXT 1210Y1000224KXT
Syfer Flexicap 1210. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1 products found
JPY: 1,130
USD: 7.09
