[ABL Components]Electronics Heating & Cooling
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Heatsink, 0.9K/W, 125 x 200 x 25mm 125AB1250B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Flatback 200mm Wide x 25mm High. It is recommended that the effectiveness of any heatsink is tested in the specific operating environment in which it will be subjected
1 products found
JPY: 12,900
USD: 80.26
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Heatsink, BGA, 10.5K/W, 10 x 49 x 49mm, Adhesive Foil BGA PP 015
BGA Heatsink, Push Pin. Push pin type BGA heatsink suitable for surface mount chip cooling and various other applications.
1 products found
JPY: 990
USD: 6.16
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Heatsink, BGA, 27K/W, 13 x 13.5 x 10mm, Adhesive Foil BGA STD 010
BGA Heatsink, Standard. Standard type BGA heatsink suitable for a variety of applications.
1 products found
JPY: 2,340
USD: 14.56
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Heatsink, BGA, 22K/W, 23 x 23 x 6mm, Adhesive Foil BGA STD 025
BGA Heatsink, Standard. Standard type BGA heatsink suitable for a variety of applications.
1 products found
JPY: 2,330
USD: 14.50
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Heatsink, 4.5°C/W, 100 x 46 x 33mm, Screw 205AB1000B
205AB Series - 46mm Wide x 33mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 3,100
USD: 19.29
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Heatsink, 0.9°C/W, 200 x 96 x 40mm, Clamp 150AB2000B
150AB Series, 96mm Wide x 40mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 10,200
USD: 63.46
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Heatsink, 1.25°C/W, 125 x 88 x 35mm 520AB1250MB
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Non Standard Extrusion 88mm Wide x 35mm High With Channel. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 4,240
USD: 26.38
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Heatsink, 0.59°C/W, 200 x 125 x 50mm 350AB2000B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Flatback 125mm Wide x 50mm High With Channel. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 11,100
USD: 69.06
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Heatsink, TO-220, 5°C/W, 50 x 50 x 28mm, Screw PPL0500B
PPL Series, TO220 Board Mount. ABL heatsinks suitable for a wide range of applications.
1 products found
JPY: 1,530
USD: 9.52
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Heatsink, TO-220, 3.7°C/W, 75 x 50 x 28mm, Screw PPL0750B
PPL Series, TO220 Board Mount. ABL heatsinks suitable for a wide range of applications.
1 products found
JPY: 1,760
USD: 10.95
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Heatsink, TO-220, 3.7°C/W, 75 x 50 x 28mm, Screw PPN0750B
PPN Series, TO220 Board Mount, Clip-On. ABL heatsinks suitable for a wide range of applications.
1 products found
JPY: 1,360
USD: 8.46
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Heatsink, TO-220, 5°C/W, 50 x 50 x 28mm, Screw PPN0500B
PPN Series, TO220 Board Mount, Clip-On. ABL heatsinks suitable for a wide range of applications.
1 products found
JPY: 1,650
USD: 10.27
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Heatsink Clip for use with Heatsink PPN Series CLIP02
PPN Series, TO220 Board Mount, Clip-On. ABL heatsinks suitable for a wide range of applications.
1 products found
JPY: 1,090
USD: 6.78
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Heatsink, 0.75K/W, 100 x 114.3 x 114.3mm 730AB1000B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Heatsink 114.3mm Wide x 114.3mm High
1 products found
JPY: 7,260
USD: 45.17
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Heatsink, BGA, 14.7K/W, 23 x 23 x 18mm, Adhesive Foil BGA STD 045
BGA Heatsink, Standard. Standard type BGA heatsink suitable for a variety of applications.
1 products found
JPY: 2,990
USD: 18.60
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Heatsink, BGA, 10.5K/W, 27 x 27 x 25mm, Adhesive Foil BGA STD 080
BGA Heatsink, Standard. Standard type BGA heatsink suitable for a variety of applications.
1 products found
JPY: 16,000
USD: 99.55
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Heatsink, 6.4°C/W, 50 x 46 x 33mm, Screw 205AB0500B
205AB Series - 46mm Wide x 33mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 1,760
USD: 10.95
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Heatsink, 0.48°C/W, 300 x 119 x 65mm 173AB3000B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. 173AB series, Universal 119mm Wide x 64.5mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 24,100
USD: 149.95
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Heatsink, 0.48°C/W, 200 x 100 x 15mm, PCB Mount 109AB2000B
Heat Sink 109AB Series, 100mm Wide x 15mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 5,450
USD: 33.91
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Heatsink, 0.07°C/W, 200 x 300 x 83mm, PCB Mount 177AB2000B
Heat Sink 177AB Series, 300mm Wide x 83mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 34,700
USD: 215.90
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Heatsink, 0.54°C/W, 100 x 150 x 25mm, PCB Mount 113AB1000B
Heat Sink 113AB Series, 150mm Wide x 25mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 5,970
USD: 37.15
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Heatsink, 0.31°C/W, 200 x 150 x 25mm, PCB Mount 113AB2000B
Heat Sink 113AB Series, 150mm Wide x 25mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 10,500
USD: 65.33
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Heatsink, 0.4°C/W, 200 x 66 x 40mm, PCB Mount 153AB2000B
Heat Sink 153AB Series, 66mm Wide x 40mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 6,740
USD: 41.94
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Heatsink, 0.24°C/W, 100 x 250 x 30mm, PCB Mount 132AB1000B
Heat Sink 132AB Series, 250mm Wide x 30mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 10,800
USD: 67.20
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Heatsink, 0.14°C/W, 200 x 250 x 30mm, PCB Mount 132AB2000B
Heat Sink 132AB Series, 250mm Wide x 30mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 16,900
USD: 105.15
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［Discontinued］Heatsink Clip for use with LS120 Heatsink, LS140 Heatsink, LS160 Heatsink, LS185 Heatsink, LS205 Heatsink, LS220 CLIP 04
Heatsink Clip 04, Pressed Clip. This clip is designed for use on the following heatsinks
1 products found
JPY: 1,060
USD: 6.60
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［Discontinued］Heatsink, 3K/W, 87.5 x 108 x 14mm 326AB0875B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Flatback 108mm Wide x 14mm High With Channel
1 products found
JPY: 1,060
USD: 6.60
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［Discontinued］Heatsink, 1.4°C/W, 100 x 96 x 40mm, Clamp 150AB1000B
150AB Series, 96mm Wide x 40mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 2,530
USD: 15.74
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［Discontinued］Heatsink, 3.3K/W, 75 x 108 x 14mm 326AB0750B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Flatback 108mm Wide x 14mm High With Channel
1 products found
JPY: 580
USD: 3.61
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［Discontinued］Heatsink, 2.2K/W, 75 x 105 x 25.4mm 525AB0750B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Low Profile Non-standard Extrusion 75mm Long With Channel
1 products found
JPY: 990
USD: 6.16
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［Discontinued］Heatsink, 1.7K/W, 100 x 98.5 x 53mm 610AB1000B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Double Sided 98.4mm Wide x 53.2mm High With Channel
1 products found
JPY: 990
USD: 6.16
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［Discontinued］Heatsink Wireform for use with BGA Hook 1
BGA Heatsink Accessories. Accessories for use with BGA heatsinks.
1 products found
JPY: 400
USD: 2.49
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［Discontinued］Heatsink, 0.14°C/W, 100 x 215 x 77mm, PCB Mount 180AB1000B
Heat Sink 180AB Series, 215mm Wide x 77mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 7,130
USD: 44.36
