[ABL Components] AllProducts
Lab Instruments & Supplies
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Electronic/Electrical Parts and Controll Equipments
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Heatsink, TO-220, TO-3P, 9°C/W, 25 x 35 x 25mm, Clip PPD0250P
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Non Standard Extrusion 35mm Wide x 25mm High With Channel
1 products found
JPY: 720
USD: 4.48
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Heatsink, TO-220, TO-3P, 7°C/W, 38 x 35 x 25mm, Clip PPD0380P
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Non Standard Extrusion 35mm Wide x 25mm High With Channel
1 products found
JPY: 750
USD: 4.67
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Heatsink, TO-220, TO-3P, 5.5K/W, 50 x 35 x 25mm, Clip PPD0500P
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Non Standard Extrusion 35mm Wide x 25mm High With Channel
1 products found
JPY: 740
USD: 4.60
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Heatsink, TO-220, 11K/W, 20 x 27 x 16mm, Clip PPC0200BP
T0220 Clip-On, 9°C/W, 11°C/W. It is recommended that the effectiveness of any heatsink is tested in the specific operating environment in which it will be subjected
1 products found
JPY: 610
USD: 3.80
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Heatsink, TO-220, TO-3P, 9°C/W, 35 x 16 x 27mm, Clip PPC0350BP
T0220 Clip-On, 9°C/W, 11°C/W. It is recommended that the effectiveness of any heatsink is tested in the specific operating environment in which it will be subjected
1 products found
JPY: 780
USD: 4.85
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Heatsink, 4.2K/W, 37.5 x 54 x 38mm 921AB0375B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Non Standard Extrusion 54mm Wide x 38mm High
1 products found
JPY: 1,460
USD: 9.08
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Heatsink, 3.2K/W, 50 x 54 x 38mm 921AB0500B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Non Standard Extrusion 54mm Wide x 38mm High
1 products found
JPY: 1,690
USD: 10.52
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Heatsink, 0.65K/W, 150 x 160 x 40mm 159AB1500B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Flatback 160mm Wide x 40mm High
1 products found
JPY: 13,900
USD: 86.49
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Heatsink, 0.55K/W, 200 x 160 x 40mm 159AB2000B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Flatback 160mm Wide x 40mm High
1 products found
JPY: 17,600
USD: 109.51
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Heatsink, 3.3K/W, 50 x 65 x 20mm 510AB0500MB
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Non Standard Extrusion 65mm Wide x 20mm High With Channel
1 products found
JPY: 1,800
USD: 11.20
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Heatsink, 1.5K/W, 100 x 88 x 25mm 515AB1000MB
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Pre-drilled to take 1 off TO3 metal can semiconuctor package. Low Profile Non-standard Extrusion With Channel. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 2,260
USD: 14.06
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Heatsink, 1.65K/W, 75 x 88 x 35mm 520AB0750MB
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Non Standard Extrusion 88mm Wide x 35mm High With Channel. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 2,630
USD: 16.36
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Heatsink, 1.4K/W, 100 x 88 x 35mm 520AB1000MB
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Non Standard Extrusion 88mm Wide x 35mm High With Channel. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 3,450
USD: 21.47
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Heatsink, 0.3K/W, 250 x 300 x 40mm 165AB2500B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Flatback 300mm Wide x 40mm High. It is recommended that the effectiveness of any heatsink is tested in the specific operating environment in which it will be subjected
1 products found
JPY: 42,700
USD: 265.68
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Heatsink, BGA, 9K/W, 49 x 49 x 15mm, Adhesive Foil BGA PP 025
BGA Heatsink, Push Pin. Push pin type BGA heatsink suitable for surface mount chip cooling and various other applications.
1 products found
JPY: 830
USD: 5.16
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Heatsink, BGA, 7K/W, 49 x 49 x 20mm, Adhesive Foil BGA PP 035
BGA Heatsink, Push Pin. Push pin type BGA heatsink suitable for surface mount chip cooling and various other applications.
1 products found
JPY: 1,430
USD: 8.90
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Heatsink, BGA, 26.5K/W, 14 x 14 x 10mm, Adhesive Foil BGA STD 015
BGA Heatsink, Standard. Standard type BGA heatsink suitable for a variety of applications.
1 products found
JPY: 2,080
USD: 12.94
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Heatsink, BGA, 24.5K/W, 21 x 21 x 9mm, Adhesive Foil BGA STD 020
BGA Heatsink, Standard. Standard type BGA heatsink suitable for a variety of applications.
1 products found
JPY: 2,720
USD: 16.92
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Heatsink, BGA, 14K/W, 20 x 20 x 19.1mm, Adhesive Foil BGA STD 050
BGA Heatsink, Standard. Standard type BGA heatsink suitable for a variety of applications.
1 products found
JPY: 2,770
USD: 17.24
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Heatsink, BGA, 13.5K/W, 40 x 40 x 10mm, Adhesive Foil BGA STD 060
BGA Heatsink, Standard. Standard type BGA heatsink suitable for a variety of applications.
1 products found
JPY: 1,220
USD: 7.59
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Heatsink, BGA, 8.2K/W, 40 x 40 x 18mm, Adhesive Foil BGA STD 115
BGA Heatsink, Standard. Standard type BGA heatsink suitable for a variety of applications.
1 products found
JPY: 780
USD: 4.85
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Heatsink, 0.5°C/W, 250 x 125 x 50mm 350AB2500B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Flatback 125mm Wide x 50mm High With Channel. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 14,000
USD: 87.11
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Heatsink, 1°C/W, 100 x 125 x 50mm 350AB1000B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Flatback 125mm Wide x 50mm High With Channel. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
1 products found
JPY: 6,780
USD: 42.19
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Heatsink, TO-220, 3.1°C/W, 100 x 50 x 28mm, Screw PPL1000B
PPL Series, TO220 Board Mount. ABL heatsinks suitable for a wide range of applications.
1 products found
JPY: 2,510
USD: 15.62
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Heatsink, TO-220, 3.1°C/W, 100 x 50 x 28mm, Screw PPN1000B
PPN Series, TO220 Board Mount, Clip-On. ABL heatsinks suitable for a wide range of applications.
1 products found
JPY: 2,390
USD: 14.87
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Heatsink, 0.6°C/W, 150 x 100 x 15mm, PCB Mount 109AB1500B
Heat Sink 109AB Series, 100mm Wide x 15mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 4,670
USD: 29.06
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Heatsink, 0.83°C/W, 100 x 100 x 15mm, PCB Mount 109AB1000B
Heat Sink 109AB Series, 100mm Wide x 15mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 3,630
USD: 22.59
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Heatsink, 0.23°C/W, 200 x 200 x 15mm, PCB Mount 122AB2000B
Heat Sink 122AB Series, 200mm Wide x 15mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 10,600
USD: 65.95
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Heatsink, 0.4°C/W, 100 x 200 x 15mm, PCB Mount 122AB1000B
Heat Sink 122AB Series, 200mm Wide x 15mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 5,970
USD: 37.15
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Heatsink, 0.29°C/W, 150 x 200 x 15mm, PCB Mount 122AB1500B
Heat Sink 122AB Series, 200mm Wide x 15mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 8,400
USD: 52.27
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Heatsink, 0.12°C/W, 100 x 300 x 83mm, PCB Mount 177AB1000B
Heat Sink 177AB Series, 300mm Wide x 83mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 21,100
USD: 131.28
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Heatsink, 0.09°C/W, 150 x 300 x 83mm, PCB Mount 177AB1500B
Heat Sink 177AB Series, 300mm Wide x 83mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 28,100
USD: 174.84
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Heatsink, 0.08°C/W, 200 x 215 x 77mm, PCB Mount 180AB2000B
Heat Sink 180AB Series, 215mm Wide x 77mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 35,900
USD: 223.37
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Heatsink, 0.1°C/W, 150 x 215 x 77mm, PCB Mount 180AB1500B
Heat Sink 180AB Series, 215mm Wide x 77mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 26,600
USD: 165.51
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Heatsink, 0.39°C/W, 150 x 150 x 25mm, PCB Mount 113AB1500B
Heat Sink 113AB Series, 150mm Wide x 25mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 8,600
USD: 53.51
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Heatsink, 0.69°C/W, 100 x 66 x 40mm, PCB Mount 153AB1000B
Heat Sink 153AB Series, 66mm Wide x 40mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 4,280
USD: 26.63
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Heatsink, 0.5°C/W, 150 x 66 x 40mm, PCB Mount 153AB1500B
Heat Sink 153AB Series, 66mm Wide x 40mm High. ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
1 products found
JPY: 6,460
USD: 40.19
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Heatsink, 0.9K/W, 125 x 200 x 25mm 125AB1250B
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Flatback 200mm Wide x 25mm High. It is recommended that the effectiveness of any heatsink is tested in the specific operating environment in which it will be subjected
1 products found
JPY: 12,900
USD: 80.26
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Heatsink, BGA, 10.5K/W, 10 x 49 x 49mm, Adhesive Foil BGA PP 015
BGA Heatsink, Push Pin. Push pin type BGA heatsink suitable for surface mount chip cooling and various other applications.
1 products found
JPY: 990
USD: 6.16
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Heatsink, BGA, 27K/W, 13 x 13.5 x 10mm, Adhesive Foil BGA STD 010
BGA Heatsink, Standard. Standard type BGA heatsink suitable for a variety of applications.
1 products found
JPY: 2,340
USD: 14.56
