Features

• Half-pitch connector responding with 1 mm pitch from 12 mm to 20 mm height between substrates by stacking connection.
• High density mounting is possible because of contact pitch 1.27 mm 2 row arrangement.
• The connection to the substrate is staggered in 4 rows (1.27 mm×1.905 mm).
• Standardized all-pole fastening pins to prevent floating and falling during soldering.
• The use of a leaf connection structure provides strong and smooth insertion and removal.
• Achieves a kangai length of 3.1 mm, greatly improving margin.
• Stable contact force is maintained by contrivance of the press fitting part. Furthermore, the use of gold-palladium plating contacts further improves contact reliability.
• UL approved product (File No. E103202).
• Cannot be engaged with the XH2/XH4 half-pitch connector.