Features

• High density mounting is possible because of contact pitch 1.27 mm 2 row arrangement.
• The connection to the substrate is staggered in 4 rows (1.27 mm×1.905 mm).
• Adoption of leaf contact structure provides strong and smooth insertion and removal.
• Achieves a kangai length of 3.1 mm, greatly improving margin.
• Stable contact force is maintained by contrivance of the press fitting part. Furthermore, the use of gold/palladium plating contacts further improves contact reliability.
• Standardized with all-pole pins to prevent flotation during soldering.
• Can also be screwed to the substrate.
• UL approved product (File No. E103202).
• Cannot be engaged with the XH3/XH4 half-pitch connector.