Syfer Flexicap 0805. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
Syfer Flexicap 0805. FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
