61-2212-22 1 liquid type Room temperature curing Type hardens heat radiation Silicon SCV-22
Features
- Solidified pasty silicon with high thermal conductivity, one-liquid type room temperature curing type.
- Simply apply between the CPU and the heatsink to improve and secure thermal conductivity.
- Has moderate viscosity and excellent workability.
- Heat dissipation of semiconductor devices such as power transistors, ICs, and CPUs.
- Filling between transistors, rectifiers, thyristors, etc., and heat sinks.
Spec
- Operating temperature range (℃): -40 - 150
- Specific gravity: 2.26
- Mass (G): 20
- Volume Resistivity (Ω ・ cm): 1.0x10 [[15 square]]
- thermal conductivity (W/m, K): 0.92
- viscosity (Paste) (pa, s): 85 - 108
- white paste
- Methyl Tri Methoxy Silane oxide Aluminum, Silica
- Application: power transistor, IC, CPU, etc. of the semiconductor De Vise. transistor rectifier thyristor and Heat Sink between filling.
- Country of origin: Japan
- Weight: 20g
- Manufacturer's model number: SCV22
- CODE No.: 327-5329
Package size：120×40×15 mm 40 g [About Package size]
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61-2212-22 1 liquid type Room temperature curing Type hardens heat radiation Silicon SCV-22特徴
仕様
荷姿サイズ：120×40×15 mm 40 g [荷姿サイズについて]
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