61-2212-22 1 liquid type Room temperature curing Type hardens heat radiation Silicon SCV-22
Features
- Solidified pasty silicon with high thermal conductivity, one-liquid type room temperature curing type.
- Simply apply between the CPU and the heatsink to improve and secure thermal conductivity.
- Has moderate viscosity and excellent workability.
- Heat dissipation of semiconductor devices such as power transistors, ICs, and CPUs.
- Filling between transistors, rectifiers, thyristors, etc., and heat sinks.
Spec
- Operating temperature range (℃): -40 - 150
- Specific gravity: 2.26
- Mass (G): 20
- Volume Resistivity (Ω ・ cm): 1.0x10 [[15 square]]
- thermal conductivity (W/m, K): 0.92
- viscosity (Paste) (pa, s): 85 - 108
- white paste
- Methyl Tri Methoxy Silane oxide Aluminum, Silica
- Application: power transistor, IC, CPU, etc. of the semiconductor De Vise. transistor rectifier thyristor and Heat Sink between filling.
- Country of origin: Japan
- Weight: 20g
- Manufacturer's model number: SCV22
- CODE No.: 327-5329
Package size：120×40×15 mm 40 g [About Package size]
| Order No. | 61-2212-22 | |
|---|---|---|
| Model No. | SCV-22 | |
| JAN Code | 4931442401703 | |
| Standard price |
JPY: 3,090
USD: 19.37
Excange rate 1USD= 159.53JPY
Valid price in Japan |
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| Quantity | 1piece | |
| Stock in Japan |
[in stock only]
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| Supplier Stock |
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Product Variations (Different Sizes, Specifications, Optional Products, etc.)
| Product image | Order No. | Name | Model No. | Quantity | Standard price | Valid price in Japan | Stock [Supplier Stock] |
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|---|---|---|---|---|---|---|---|---|
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61-2212-22 | 1 liquid type Room temperature curing Type hardens heat radiation Silicon SCV-22 | SCV-22 | 1piece | JPY: 3,090 | USD: 19.37 |
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61-2212-23 | ［Discontinued］Hardens heat radiation silicon SCV-T500 | SCV-T500 | 1piece | JPY: 50,990 | USD: 319.63 |
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