61-0484-18 Lead Free Solder Tin, Silver, Copper 0.6φ HS-361
Features
- Uses fluxes with little scattering.
- It is an alloy recommended by JEITA. It has been used since the beginning of lead-free production and is a reliable and proven solder.
Spec
- Weight: 11g
- Component: Sn-3Ag-0.5Cu
- Solid phase, Liquid phase temperature: 217℃, 220℃
- Wire diameter: 0.6mmφ
- Length (reference): 5.6m
- Bobbin type: S
Package size：160×40×20 mm 10 g [About Package size]
| Order No. | 61-0484-18 | |
|---|---|---|
| Model No. | HS-361 | |
| JAN Code | 4962772053614 | |
| Standard price |
JPY: 1,170
USD: 7.33
Excange rate 1USD= 159.53JPY
Valid price in Japan |
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| Quantity | 1piece | |
| Stock in Japan |
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| Supplier Stock |
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Product Variations (Different Sizes, Specifications, Optional Products, etc.)
| Product image | Order No. | Name | Model No. | Quantity | Standard price | Valid price in Japan | Stock [Supplier Stock] |
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|---|---|---|---|---|---|---|---|---|
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61-0484-18 | Lead Free Solder Tin, Silver, Copper 0.6φ HS-361 | HS-361 | 1piece | JPY: 1,170 | USD: 7.33 |
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61-0484-19 | Lead Free Solder Tin, Silver, Copper 0.8φ HS-362 | HS-362 | 1piece | JPY: 1,160 | USD: 7.27 |
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61-0484-20 | Lead Free Solder Tin, Silver, Copper 1.0φ HS-363 | HS-363 | 1piece | JPY: 1,160 | USD: 7.27 |
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