60-9846-99 Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ0.6 mm 10 m FS521-061001
Features
- It is a lead-free solder recommended by JEITA* and has been used since the introduction of lead-free solder. It has been adopted in many manufacturing sites.
- *Japan Electronics and Information Technology Industries Association
Spec
- thread solder
- lead-free solder
- Composition: Sn-3.0Ag-0.5Cu
- Melting point: 217~220°C
- Wire Diameter: Φ0.6 mm
- flux cored
- Content: 10 m roll
Package size：95×29×130 mm 30 g [About Package size]
| Order No. | 60-9846-99 | |
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| Model No. | FS521-061001 | |
| JAN Code | 4962615065859 | |
| Standard price |
JPY: 1,670
USD: 10.39
Excange rate 1USD= 160.72JPY
Valid price in Japan |
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| Quantity | 1piece | |
| Stock in Japan |
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| Supplier Stock |
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Product Variations (Different Sizes, Specifications, Optional Products, etc.)
| Product image | Order No. | Name | Model No. | Quantity | Standard price | Valid price in Japan | Stock [Supplier Stock] |
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60-9846-98 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ0.3 mm 10 m FS521-031001 | FS521-031001 | 1piece | JPY: 890 | USD: 5.54 |
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60-9846-99 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ0.6 mm 10 m FS521-061001 | FS521-061001 | 1piece | JPY: 1,670 | USD: 10.39 |
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60-9847-01 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ0.8 mm 10 m FS521-081001 | FS521-081001 | 1piece | JPY: 2,500 | USD: 15.56 |
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60-9847-02 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ1.0 mm 10 m FS521-101001 | FS521-101001 | 1piece | JPY: 3,600 | USD: 22.40 |
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60-9847-03 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ1.2 mm 10 m FS521-121001 | FS521-121001 | 1piece | JPY: 5,020 | USD: 31.23 |
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60-9847-04 | Wound Solder Hexzole Lead-free Sn-3.0Ag-0.5Cu Φ1.6 mm 10 m FS521-161001 | FS521-161001 | 1piece | JPY: 8,670 | USD: 53.95 |
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