ข้อมูลจําเพาะ

• Pitch: 1.27 mm (maximum 40 p connection), 2.54 mm (maximum 20 p connection)
• Material: Pin Section ... Beryllium Copper Resin Section ... LCP Resin Black
• Treatment: Nickel Underlay Gold Plating
• Current rating: 1A
• Rated voltage: 125 V AC, DC
• Contact resistance: 30 m.OMEGA. or less
• Insulation resistance: 500 megohms or more
• Insulation voltage: 1000 V, AC, DC 1 minute
• Print board mounting holes: 0.4 ~ 0.5 phi (soldered side)
• Through hole compatible with printed circuit board: 0.8 ~ 0.9 phi TH finish diameter (contact side)
• Printed circuit board compatible thickness: 0.8 ~ 1.6 t
• Operating humidity range: 0 ~ 85% rh (no condensation)
• Number of times used: 50 or fewer
• Use it when mounting the print board at right angles. Because copper oxidizes quickly, the insertion and removal sides can not be used for copper through-hole substrates.
• RoHS compliant
• Quantity: 1 bag (10 bottles)
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