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• HIROSE ELECTRIC DF13 Series 1.25 mm Substrate Header Connector • The DF13 Series 1.25 mm Substrate Header has a compact miniature design and is available in 1 and 2 row configurations.　The space-saving two-column header achieves 30% higher density over the same area than the single-column design.　The DF13 board header has a low profile with a height of 5.8 mm (SMT straight mounting) and 5.3 mm (straight through hole mounting) from the board.　These header housings have a scoop proof box structure and a polarizing slot to prevent accidental insertion.　The friction lock mechanism allows the header to be firmly connected to the DF13 housing to be engaged.　The DF13 board header has board mounting bosses for accurate alignment and placement on the board. The surface mount model is firmly attached to the substrate and also has metal fittings to prevent solder peeling.　Some DF13 headers have vacuum pickup areas that support automatic pick-and-place. Some products are offered in embossed tape and reel packaging.　The DF13 series 1.25 mm board header meshes with the DF13 series 1.25 mm board crimping connector housing.
• Features and benefits: Compact space-saving designTwo-row scoop-proof housing 30% denser than single-row configurations with the same substrate footprint Polarization slots Realize secure engagement connectionFriction lock mechanismSubstrate-mounted boss that can be accurately placed on the substrate Surface mount model mounting bracket that can be securely attached to the substrate Ready for automatic pick-and-place mounting Embossed tape and reel packaging Applications: DF13 Series connectors are ideal for space-saving, multi-signal mobile devices. Applications include digital cameras, LDC displays, digital video recorders, car navigation systems, access control units and measurement devices.