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• TE Connectivity 1.27 mm x 2.54 mm AMPMODU System 50 Substrate-to-Substrate Headers
• AMPMODU System 50 1.27 x 2.54 mm Shrouded/Shroudless Substrate-to-Substrate Header Connectors are designed with high density to save substrate space.　The AMPMODU System 50 1.27 x 2.54 mm header housing is made of heat-resistant plastic, has a polar design for easy connector engagement, and has a standoff for discharge.　The shroudless type of this AMPMODU System 50 header can be closely connected to the daughter card.　The AMPMODU System 50 1.27 x 2.54 mm Substrate-to-Substrate Header is available in a variety of configuration types, including 1, 2, vertical, light angle, through hole, and SMT.　Manufacturer model numbers x-104074 x and x-104069 x have solder clip/board hold down posts.