기능

• Low viscosity.
• Has a relatively long pot life and can be used for approximately 4~5 hours (23°C).
• Solvent-free.
• Curing at room temperature is possible, but heat curing (60°C for 2 hours or 80°C for 1 hour) is usually used.
• When combined with epoxy resin,
• a)Strongly adheres metal, glass, ceramic, plastic, etc.
• b)As it is a chemical reaction type adhesive, it has excellent heat resistance, water resistance and oil resistance.
• c)Electrical insulation.
• d)Gap filling and filling adhesion.
• Curing Agent D is a curing agent for epoxy resin which mainly contains aliphatic polyamine.
• Use in combination with 1565 main agent.
• The cured material has excellent heat resistance and is almost colorless and light yellow transparent, making it suitable for adhesion of transparent materials such as metals, lenses and prisms.