기능

• Spring Load Test Terminal
• This spring load terminal enables rapid multipoint testing of substrate subassemblies during development and production.
• It is designed to be pushed into a pre-made test bed or epoxy-bonded to align with the tracks and pins of the board being tested.
• Part number 521-601 has a gold-plated brass recessed probe for positioning the substrate pins and soldering joints.
• Part number 521-611 has a nickel-plated carbon steel cusp probe that connects to flat tracks and pads.
• The probe is housed in a gold-plated brass body with a gold-plated steel spring.
• Solder post connection to terminal Recommended testbed thickness: 5 mm minimum (epoxy bonded) 12 mm maximum (indented) 15 mm maximum