Spec

• Pitch: 1.27 mm (maximum 40 p connection), 2.54 mm (maximum 20 p connection)
• Material: Pin Section ... Beryllium Copper-Nickel Underlay Gold-Plated Resin Section ... LCP Resin Black
• Current rating: 1A
• Rated voltage: 125 V AC, DC
• Contact resistance: 30 m.OMEGA. or less
• Insulation resistance: 500 megohms or more
• Insulation voltage: 1000 V, AC, DC 1 minute
• Through hole compatible with printed circuit board: 0.8 ~ 0.9 phi TH finish diameter (contact side)
• Printed circuit board compatible thickness: 0.8 ~ 1.6 t
• Operating temperature range: -40 to + 125 degrees C
• Operating humidity range: 0 ~ 85% rh (no condensation)
• Number of times used: 50 or fewer
• One unit of this product can be used for both males and females. The socket is unnecessary, so the height of the PC board versus the PC board can be lowered. (1 mm to 10 mm) XB Series The soldered side is also springy, so the product does not tilt and can stand upright. Both sides can also be soldered. Because copper oxidizes quickly, the insertion and removal sides can not be used for copper through-hole substrates.
• RoHS compliant
• Quantity: 1 bag (10 bottles)
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