DuPont Toray Specialty Materials K.K.

Silpot 184 W/C 1Kg (with Catalyst)　SILPOT

It is the most commonly used silicon resin in microdevice fabrication. Before curing, the resin is a soft gel and can penetrate into gaps as small as 1 μm, making it possible to transfer micro-sized designs.
After curing, it is transparent and easy to observe. It is also an inexpensive material with excellent durability.