67-6461-53　Wafer with 12 inch Ti+Cu (Sputtered) Film (Ti50 nm+Cu100nm ±10% [P (100), 1-100 Ω] for Research Use, Double-sided Mirror DF Product, 25 Pieces　

Features

We have a proven track record for research and development, and offer wafers made from high-purity materials from small quantities.

Spec

Size: 12 inch silicon wafer
Ti (Titanium) +Cu (Copper) [Sputtering] Film Thickness: 50 nm+100 nm±10% (Data Included)
Diameter (mm): 300.0±0.5
Wafer thickness (μm): 775±25
Manufacturing method: CZ method
Conductive Type: P Type
Face Bearing: 100
Resistance value (Ω · cm): 1~100
V Notch
Face States: Mirror/Mirror
particles: dust free
TTV(μm):≦20
Quantity: 25 sheets (1 box)
*custom-made product
We also have a variety of other products, such as laminated films and patterning, so please feel free to contact us.
Various shapes and surface treatments are possible (Examples: Etching, Counterboring, Drilling, Oxidized Wafers).
It is possible to match the specific resistivity and wafer thickness you desire.
*Although this product is manufactured and processed using crystal materials for semiconductors, it is not possible to verify the purity of the material.
*We do not ask any questions about the products with film unevenness or film thickness.

Package size：410×460×420 mm　1 kg　 [About Package size]

Order No.	67-6461-53
Standard price	JPY: 1,024,800 USD: 6,376.31 Excange rate 1USD= 160.72JPY Valid price in Japan
Quantity	1box(25sheets)
Stock in Japan
Supplier Stock

Product Catalog

Catalog Name	Page
AS ONE Catalog 2025 [Instruments for Laboratory]	1939