67-6458-39 Wafer with 4 inch W (Sputtered) Film (for 50 nm Research [P (100), 1-100 Ω] Single-sided Mirror DF Product, 1 Piece Included 

Features

  • We have a proven track record for research and development, and offer wafers made from high-purity materials from small quantities.

Spec

  • Size: 4-inch silicon wafer
  • W (Tungsten) [Sputtering] Film Thickness: 50nn Aim (with Data)
  • Diameter (mm): 100.0±0.2
  • Wafer thickness (μm): 525±25
  • Manufacturing method: CZ method
  • Conductive Type: P Type
  • Face Bearing: 100
  • Resistance value (Ω · cm): 1~100
  • OF length (mm): 32.5±2.5
  • Face State: Mirror/Etched
  • particles: dust free
  • TTV(μm):≦20
  • Quantity: 1 (1 box)
  • *custom-made product
  • We also have a variety of other products, such as laminated films and patterning, so please feel free to contact us.
  • Various shapes and surface treatments are possible (Examples: Etching, Counterboring, Drilling, Oxidized Wafers).
  • It is possible to match the specific resistivity and wafer thickness you desire.
  • *Although this product is manufactured and processed using crystal materials for semiconductors, it is not possible to verify the purity of the material.
  • *We do not ask any questions about the products with film unevenness or film thickness.
  •  

Package size:200×210×260 mm 1 kg  [About Package size]

Order No. 67-6458-39
Standard price JPY: 237,300 USD: 1,487.50
Excange rate 1USD= 159.53JPY
Valid price in Japan
Quantity 1sheet/box
Stock in Japan
Supplier Stock

Product Catalog

Catalog Name Page
AS ONE Catalog 2025 [Instruments for Laboratory] 1939