Spec

• Size: 114 x 114 x 0.32 mm
• Surface roughness: ≤0.8 Ra
• Temporary specific gravity: 3.20± 0.05 g/cm3
• Elastic modulus: 300~320Gpa
• Poisson's ratio: ≤0.29 - Vickers hardness ≥14.2Gpa
• Linear thermal expansion coefficient (25 °C to 500 °C): 3.0~3.2 10-6/°C
• Fracture Toughness: 6.0~7.0 MPa
• Bending strength (three point bending): 700~800 Mpa
• Thermal conductivity (25 °C): ≥85 W/(m · k)
• Quantity: 1 box (10 sheets) * 1 case per 1 sheet
• *custom-made product
• The azimuth (cutting angle), OF azimuth angle tolerance, and thickness tolerance can be reduced and processed with high precision, enabling accurate groove formation during etching.
• Various shapes and surface treatments are possible (Examples: gouging, drilling, wafer with oxide film).
• It is possible to match the specific resistivity and wafer thickness you desire.
• *Although this product is manufactured and processed using crystal materials for semiconductors, it is not possible to verify the purity of the material.
• *In the case of a special order order, please coordinate with the supplier.
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