65-3736-05　3 inch Silicone Wafer Research [P (100), 1-100 Ω,] Single-sided Mirror DF Product 25 Pieces　

Features

We have a proven track record for research and development, and offer wafers made from high-purity materials from small quantities.

Size: 3-inch silicon wafer
Diameter (mm): 76.0±0.2
Wafer thickness (μm): 380±25
Manufacturing method: CZ method
Conductive Type: P Type
Face Bearing: 100
OF bearing: 110
Resistance value (Ω · cm): 1~100
OF length (mm): 22.5±2.5
Face State: Mirror/Etched
particles: > 0.3 μm, < 20 particles
TTV(μm):≦25
Quantity: 25 sheets (1 box)
*Custom-made products:
The azimuth (cutting angle), OF azimuth angle tolerance, and thickness tolerance can be reduced and processed with high precision, enabling accurate groove formation during etching.
Various shapes and surface treatments are possible (Examples: gouging, drilling, wafer with oxide film).
It is possible to match the specific resistivity and wafer thickness you desire.
*Although this product is manufactured and processed using crystal materials for semiconductors, it is not possible to verify the purity of the material.
With 1st Orifra, Without 2nd Orifra

Package size：220×215×140 mm　430 g　 [About Package size]

Order No.	65-3736-05
Standard price	JPY: 64,900 USD: 407.10 Excange rate 1USD= 159.42JPY Valid price in Japan
Quantity	1box(25sheets)
Stock in Japan
Supplier Stock

Catalog Name	Page
AS ONE Catalog 2025 [Instruments for Laboratory]	1939