64-2030-14 Heatsink, PGA, 4.25K/W, 28.5 (Dia.) x 18.5mm, Adhesive Foil, Conductive Foil ICK S R 28,5x18,5
Features
- ICK S R Series. Round heatsinks for ICs, which are also designed for use with LEDs (see also ICK LED R heatsinks, typical SN 674-4771 ). Al-natural surface Mounting by clamp, foil or adhesive
Spec
- Quantity:1piece
- For Use With:PGA
- Height:18.5mm
- Dimensions:28.5 (Dia.) x 18.5mm
- Thermal Resistance:4.25K/W
- Mounting:Adhesive Foil, Conductive Foil
- Diameter:28.5mm
- CODE No.:674-4832
| Order No. | 64-2030-14 | |
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| Model No. | ICK S R 28,5x18,5 | |
| Standard price |
JPY: 1,410
USD: 8.77
Excange rate 1USD= 160.72JPY
Valid price in Japan |
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| Quantity | 1piece | |
| Stock in Japan |
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| Supplier Stock |
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