Bergquist

64-0514-41 [Discontinued]Thermal Interface Pad, Hi-Flow 650P, 1.5W/m·K 0.001in, Self-Adhesive HF650P-0.001-01-00-122

Features

  • Hi-Flow 650P. Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi) 150°C high temperature reliability Natural tack one side for ease of assembly Exceptional thermal performance in an insulated pad

Spec

  • Quantity:1bag(50pieces)
  • Thickness:0.001in
  • Thermal Conductivity:1.5W/m·K
  • Material:Hi-Flow 650P
  • Self-Adhesive:Yes
  • Minimum Operating Temperature:-40°C
  • Maximum Operating Temperature:+150°C
  • Material Trade Name:Hi-Flow 650P
  • Operating Temperature Range:-40 → +150 °C
  • CODE No.:752-4893
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Order No. 64-0514-41
Model No. HF650P-0.001-01-00-122
Standard price JPY: 25,900 USD: 162.35
Excange rate 1USD= 159.53JPY
Valid price in Japan
Quantity 1bag(50pieces)
  Discontinued
Stock in Japan -