64-0514-39 ［Discontinued］Thermal Interface Sheet, Hi-Flow 650P, 1.5W/m·K, 11 x 12in 0.001in, Self-Adhesive HF650P-0.001-01-1112-NA
Features
- Hi-Flow 650P. Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi) 150°C high temperature reliability Natural tack one side for ease of assembly Exceptional thermal performance in an insulated pad
Spec
- Quantity:1piece
- Dimensions:11 x 12in
- Thickness:0.001in
- Length:11in
- Width:12in
- Thermal Conductivity:1.5W/m·K
- Material:Hi-Flow 650P
- Self-Adhesive:Yes
- Minimum Operating Temperature:-40°C
- Maximum Operating Temperature:+150°C
- Material Trade Name:Hi-Flow 650P
- Operating Temperature Range:-40 → +150 °C
- CODE No.:752-4887
| Order No. | 64-0514-39 | |
|---|---|---|
| Model No. | HF650P-0.001-01-1112-NA | |
| Standard price |
JPY: 22,400
USD: 139.37
Excange rate 1USD= 160.72JPY
Valid price in Japan |
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| Quantity | 1piece | |
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| Stock in Japan | - | |