Features

• Gap Pad® 2500S20. Gap Pad® 2500S20 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K. The material is a filled-polymer material yielding extremely soft, elastic characteristics. The material is reinforced to provide easy handling and converting, added electrical isolation and tear resistance. Gap Pad® 2500S20 is well suited for low-pressure applications that typically use fixed standoff or clip mounting. The material maintains a conformable, yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. Gap Pad® 2500S20 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. The material is supplied with protective liners on both sides. The top side has reduced tack for ease of handling. Typical applications include between processors and heat sinks, between graphics chips and heat sinks, DVD and CD-ROM electronics cooling and areas where heat needs to be transferred to a frame, chassis or other type of heat spreader. Thermal conductivity: 2.4 W/m-K Low "S-Class" thermal resistance at ultra-low pressures Ultra conformable, "gel-like" modulus Designed for low-stress applications Fibreglass reinforced for puncture, shear and tear resistance