64-0432-68 ［Discontinued］Surface Mount (SMT) Board TSOP I Epoxy Glass Double-Sided 43.5 x 29 x 1.5mm FR4 RE900-01
Features
- TSOP I/II Adaptor Boards, RE900. 1.5 mm FR4 epoxy, 35 μm CU on both sides Plated drill holes, Ø 1 mm Soldering and component side surface made of chem. nickel/gold (Ni/Au) and solder mask Pre-scored breaking points for detaching individual modules from the board Size 72.6 x 76.2 mm Adaption board for 14 different SMD TSOP I and 7 different SMD TSOP II chips
Spec
- Quantity:1piece/bag
- SMD Component Type:TSOP I
- Base Material:Epoxy Glass Fabric Laminate
- Number of Sides:2
- Dimensions:43.5 x 29 x 1.5mm
- Copper Thickness:35µm
- Hole Diameter:1mm
- Hole Pitch:0.4 x 0.4mm
- FR Material Grade:FR4
- Length:43.5mm
- Thickness:1.5mm
- Width:29mm
- CODE No.:728-8816
| Order No. | 64-0432-68 | |
|---|---|---|
| Model No. | RE900-01 | |
| Standard price |
JPY: 1,560
USD: 9.78
Excange rate 1USD= 159.53JPY
Valid price in Japan |
|
| Quantity | 1piece/bag | |
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| Stock in Japan | - | |