64-0432-50 [Discontinued]RE01-LFDS, Double-Sided Plain Copper Ink Resist Board FR4 With 35μm Copper Thick, 160.15 x 100.2 x 1.5mm RE01-LFDS
Features
- Board is not photoresist. Copper-Clad Epoxy FR4 Boards, RE01. These 35 μm copper-clad boards (thickness 1.5mm) are for producing PCBs Suitable etchant is ferric chloride solution Single and Double sided Board size 100 x 4106 x 1.5mm
Spec
- Quantity:1piece/bag
- Base Material:Epoxy Glass Fabric Laminate
- Number of Sides:2
- Dimensions:160.15 x 100.2 x 1.5mm
- Copper Thickness:35µm
- FR Material Grade:FR4
- Length:160.15mm
- Thickness:1.5mm
- Width:100.2mm
- CODE No.:728-8705
Package size:100×160×5 mm 60 g [About Package size]
| Order No. | 64-0432-50 | |
|---|---|---|
| Model No. | RE01-LFDS | |
| Standard price |
JPY: 800
USD: 4.98
Excange rate 1USD= 160.72JPY
Valid price in Japan |
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| Quantity | 1piece/bag | |
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| Stock in Japan | - | |
![[Discontinued]RE01-LFDS, Double-Sided Plain Copper Ink Resist Board FR4 With 35μm Copper Thick, 160.15 x 100.2 x 1.5mm RE01-LFDS](https://aimg.as-1.co.jp/c/64/0432/50/64043250.jpg?v=03790be0f2ba82c1280907a7033cf49dabaaa7c1)