64-0199-41 Heatsink, BGA, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil ICK BGA 27x27x22
Features
- Fischer Elektronik ICK BGA Series Heatsink. ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and Benefits Black anodised surface. Heatsink dimensions match respective BGA-type. Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
Spec
- Quantity:1piece/bag
- For Use With:BGA
- Length:27mm
- Width:27mm
- Height:22mm
- Dimensions:27 x 27 x 22mm
- Thermal Resistance:13.5K/W
- Mounting:Adhesive Foil, Conductive Foil
- Colour:Black
- CODE No.:674-4753
| Order No. | 64-0199-41 | |
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| Model No. | ICK BGA 27x27x22 | |
| Standard price |
JPY: 1,540
USD: 9.58
Excange rate 1USD= 160.72JPY
Valid price in Japan |
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| Quantity | 1piece/bag | |
| Stock in Japan |
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| Supplier Stock |
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