64-0199-40 Heatsink, PGA, 10.9K/W, 27.95 x 24.76 x 15.24mm, Adhesive Foil, Conductive Foil ICK PGA 11x11
Features
- ICK PGA Series. Heatsinks for IC processor. Black anodised surface Mounting by thermally conductive foil or thermally conductive adhesive
Spec
- Quantity:1piece/bag
- For Use With:PGA
- Length:27.95mm
- Width:24.76mm
- Height:15.24mm
- Dimensions:27.95 x 24.76 x 15.24mm
- Thermal Resistance:10.9K/W
- Mounting:Adhesive Foil, Conductive Foil
- Colour:Black
- CODE No.:674-4725
| Order No. | 64-0199-40 | |
|---|---|---|
| Model No. | ICK PGA 11x11 | |
| Standard price |
JPY: 1,130
USD: 7.03
Excange rate 1USD= 160.72JPY
Valid price in Japan |
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| Quantity | 1piece/bag | |
| Stock in Japan |
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| Supplier Stock |
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