Features

• High Frequency Module (PA/ANT/VCO/SAW etc.) for Mobile Phones, Mobile Phones, "Bluetooth," W-LAN, High Frequency Circuits General
• Chip Inductor (Coil) High Frequency, Windings Horizontal Windings Type L 1608 Size
• 3.6~470 nH wide inductance covered in E24 steps. The horizontal winding type achieves ±0.2 nH and ± 2% narrow deviation inductance. Inductance can be unadjusted in the circuit The ultra-small size (1.6 x 0.8 mm) allows high-density mounting The self-resonant frequency is extremely high, and high Q and stable inductance can be obtained at high frequencies The low DC resistance design makes it easy to mount because of the low loss and high power and low power consumption design The top surface is coated with resin.