64-0090-03 [Discontinued]RE230-LF, Single Sided Matrix Board FR4 with 40 x 60 1.02mm Holes, 2.54 x 2.54mm Pitch, 165.1 x 114.3 x 1.6mm RE230-LF
Features
- RE230-LF Laboratory Card. Non-European Format Size: 114.3 x 165.1 mm Material thickness: 1.6 mm FR4 Copper lamination 35 μm, hot dip tin-plated on one side (HAL) and coated with a solder mask Hole pattern: 2.54 x 2.54 mm 40 x 60 bore hole rows 40 x 58 2 mm quadratic soldering islands Hole diameter: 1.02 mm Max. Operating temperature: 150 °C
Spec
- Quantity:1piece/bag
- Number of Sides:1
- Hole Pitch:2.54 x 2.54mm
- Dimensions:165.1 x 114.3 x 1.6mm
- Length:165.1mm
- Width:114.3mm
- Thickness:1.6mm
- Base Material:Epoxy Glass Fabric Laminate
- Hole Diameter:1.02mm
- FR Material Grade:FR4
- Hole Layout:40 x 60
- Copper Thickness:35µm
- CODE No.:528-0712
| Order No. | 64-0090-03 | |
|---|---|---|
| Model No. | RE230-LF | |
| Standard price |
JPY: 3,580
USD: 22.44
Excange rate 1USD= 159.53JPY
Valid price in Japan |
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| Quantity | 1piece/bag | |
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| Stock in Japan | - | |
![[Discontinued]RE230-LF, Single Sided Matrix Board FR4 with 40 x 60 1.02mm Holes, 2.54 x 2.54mm Pitch, 165.1 x 114.3 x 1.6mm RE230-LF](https://aimg.as-1.co.jp/c/64/0090/03/64009003.jpg?v=03790be0f2ba82c1280907a7033cf49dabaaa7c1)