64-0090-01 ［Discontinued］RE232-LF, Single Sided Matrix Board FR4 with 40 x 60 1.02mm Holes, 2.54 x 2.54mm Pitch, 165.1 x 114.3 x 1.6mm RE232-LF
Features
- RE232-LF Laboratory Card for DIL ICs. Non-European Format Size: 114.3 x 165.1 mm Material thickness: 1.6 mm FR4 Copper coating 35 μm, hot dip tin-plated on soldering side only (HAL) Component overlay on component side Hole pattern: 2.54 x 2.54 mm (1//20") 40 x 60 bore hole rows 3-hole soldering islands 4 DIP IC rows, 7.62 mm sequence, 15.24 mm with 48 connections Hole diameter: 1.02 mm Max. Operating temperature: 150 °C
Spec
- Quantity:1piece/bag
- Number of Sides:1
- Hole Pitch:2.54 x 2.54mm
- Dimensions:165.1 x 114.3 x 1.6mm
- Length:165.1mm
- Width:114.3mm
- Thickness:1.6mm
- Base Material:Epoxy Glass Fabric Laminate
- Hole Diameter:1.02mm
- FR Material Grade:FR4
- Hole Layout:40 x 60
- Copper Thickness:35µm
- CODE No.:528-0683
| Order No. | 64-0090-01 | |
|---|---|---|
| Model No. | RE232-LF | |
| Standard price |
JPY: 3,850
USD: 23.96
Excange rate 1USD= 160.72JPY
Valid price in Japan |
|
| Quantity | 1piece/bag | |
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| Stock in Japan | - | |