63-7801-76 ［Discontinued］Thermal Interface Pad, Hi-Flow 650P, 1.5W/m·K 0.001in, Self-Adhesive HF650P-0.001-01-00-54
Features
- Hi-Flow 650P. Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi) 150°C high temperature reliability Natural tack one side for ease of assembly Exceptional thermal performance in an insulated pad
Spec
- Quantity:1bag(50pieces)
- Thickness : 0.001in
- Thermal Conductivity : 1.5W/m·K
- Material : Hi-Flow 650P
- Self-Adhesive : Yes
- Minimum Operating Temperature : -40°C
- Maximum Operating Temperature : +150°C
- Material Trade Name : Hi-Flow 650P
- Operating Temperature Range : -40 → +150 °C
- CODE No.:752-4881
| Order No. | 63-7801-76 | |
|---|---|---|
| Model No. | HF650P-0.001-01-00-54 | |
| Standard price |
JPY: 6,100
USD: 37.95
Excange rate 1USD= 160.72JPY
Valid price in Japan |
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| Quantity | 1bag(50pieces) | |
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| Stock in Japan | - | |