63-7507-32 ［Discontinued］Thermal Interface Pad, Hi-Flow 625, 0.5W/m·K, 25 x 19mm 0.127mm, Self-Adhesive HF625-0.005-AC-104
Features
- HI-FLOW phase change product. The HI-FLOW flexible replaces thermal grease. Flexible substrate on aluminium with thermal conduction properties equivalent to those of thermal grease without its drawbacks during production. HI-FLOW 625 provides excellent thermal contact between 2 surfaces and insulation up to 4,000 V. Products available in dry version (DRY terminals or terminals with one face coated with thermal acrylic adhesive for easy positioning (AC terminals)
Spec
- Quantity:1bag(50pieces)
- Dimensions : 25 x 19mm
- Thickness : 0.127mm
- Length : 25mm
- Width : 19mm
- Thermal Conductivity : 0.5W/m·K
- Material : Hi-Flow 625
- Self-Adhesive : Yes
- Minimum Operating Temperature : -30°C
- Maximum Operating Temperature : +150°C
- Material Trade Name : Hi-Flow 625
- Operating Temperature Range : -30 → +150 °C
- CODE No.:362-9676
| Order No. | 63-7507-32 | |
|---|---|---|
| Model No. | HF625-0.005-AC-104 | |
| Standard price |
JPY: 8,500
USD: 52.89
Excange rate 1USD= 160.72JPY
Valid price in Japan |
|
| Quantity | 1bag(50pieces) | |
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| Stock in Japan | - | |