63-6546-29 ［Discontinued］Heatsink, BGA, 23.4°C/W, 28.58 (Dia.) x 9.14mm 34182
Features
- BGA Heatsink, Radial Fin. Bond-on heatsinks for leadless chip carriers and flat-packs. Primarily designed for 68-pin devices Suitable for high-power LEDs
Spec
- Quantity:1piece
- For Use With : BGA
- Height : 9.14mm
- Dimensions : 28.58 (Dia.) x 9.14mm
- Thermal Resistance : 23.4°C/W
- Diameter : 28.58mm
- Colour : Black
- CODE No.:103-825
| Order No. | 63-6546-29 | |
|---|---|---|
| Model No. | 34182 | |
| Standard price |
JPY: 2,710
USD: 16.99
Excange rate 1USD= 159.53JPY
Valid price in Japan |
|
| Quantity | 1piece | |
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| Stock in Japan | - | |