63-5029-11 ［Discontinued］Surface Mount (SMT) Board TSOP I Epoxy Glass Double-Sided 30.5 x 16.5 x 1.5mm FR4 RE900-03
Features
- TSOP I/II Adaptor Boards, RE900. 1.5 mm FR4 epoxy, 35 μm CU on both sides Plated drill holes, Ø 1 mm Soldering and component side surface made of chem. nickel/gold (Ni/Au) and solder mask Pre-scored breaking points for detaching individual modules from the board Size 72.6 x 76.2 mm Adaption board for 14 different SMD TSOP I and 7 different SMD TSOP II chips
Spec
- Quantity：1piece
- SMD Component Type : TSOP I
- Base Material : Epoxy Glass Fabric Laminate
- Number of Sides : 2
- Dimensions : 30.5 x 16.5 x 1.5mm
- Copper Thickness : 35µm
- Hole Diameter : 1mm
- Hole Pitch : 0.5 x 0.5mm
- FR Material Grade : FR4
- Length : 30.5mm
- Thickness : 1.5mm
- Width : 16.5mm
- CODE No.:728-8828
| Order No. | 63-5029-11 | |
|---|---|---|
| Model No. | RE900-03 | |
| Standard price |
JPY: 1,940
USD: 12.16
Excange rate 1USD= 159.53JPY
Valid price in Japan |
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| Quantity | 1piece | |
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| Stock in Japan | - | |