63-4825-35 Heatsink, BGA, 31 x 31 x 28mm, Clip MBH31001-28W/2.6
Features
- BGA Chipset Heat Sinks. High-performance precision-forged clip-attachment heatsinks for BGA chipsets. AL6063 grade aluminium at 201 W/m K thermal conductivity Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance Attachment by plastic clip Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
Spec
- Quantity：1piece
- For Use With : BGA
- Length : 31mm
- Width : 31mm
- Height : 28mm
- Dimensions : 31 x 31 x 28mm
- Mounting : Clip
- Colour : Black
- CODE No.:489-6091
| Order No. | 63-4825-35 | |
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| Model No. | MBH31001-28W/2.6 | |
| Standard price |
JPY: 2,280
USD: 14.29
Excange rate 1USD= 159.53JPY
Valid price in Japan |
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| Quantity | 1piece | |
| Stock in Japan |
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| Supplier Stock |
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