63-4825-32 ［Discontinued］Heatsink, BGA, 27 x 27 x 12mm, Clip MBH27002-12P/2.6
特徴
- BGA Chipset Heat Sinks. High-performance precision-forged clip-attachment heatsinks for BGA chipsets. AL6063 grade aluminium at 201 W/m K thermal conductivity Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance Attachment by plastic clip Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
仕様
- Quantity：1piece
- For Use With : BGA
- Length : 27mm
- Width : 27mm
- Height : 12mm
- Dimensions : 27 x 27 x 12mm
- Mounting : Clip
- Colour : Black
- CODE No.:489-6035
| アズワン品番 | 63-4825-32 | |
|---|---|---|
| 型番 | MBH27002-12P/2.6 | |
| 標準価格 |
JPY: 830
USD: 5.16
Excange rate 1USD= 160.72JPY
Valid price in Japan |
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| 入り数 | 1piece | |
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| 在庫数 | - | |